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US 6,954,984 B2Granted
Land grid array structure
AssigneeInternational Business Machines Corporation
InventorsMichael F. McAllister, John G. Torok
Life of this patent
Estimating the term…
Abstract
A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.
Claims17
A method of making an engineering change for a system board structure, comprising the steps of:
- providing a system board,
- providing a plurality of chip carrier modules for a next level of integration provided by a system board, at least one of which plurality of chip carrier modules has a functional connection that could be desirably changed,
- and providing a flex film carrier between the system board and the chip carrier modules that fulfills a desired engineering change by physically changing an original connection to another desired connection between said chip carrier modules that could be desireably changed and the system board,
- wherein said physically changing an original connection includes of
- inserting one or more insulating plugs on the system board to change said original connection to another to accomplish said physical changing of the original connection to another desired connection between the chip carrier modules and the system board.
2 more elements
A method of making an engineering change for a system board structure, comprising the steps of:
- providing a system board,
- providing a plurality of chip carrier modules for a next level of integration provided by a system board, at least one of which plurality of chip carrier modules has a functional connection that could be desirably changed,
- and providing a flex film carrier between the system board and the chip carrier modules that fulfills a desired engineering change by physically changing an original connection to another desired connection between said chip carrier modules that could be desireably changed and the system board,
- wherein said physically changing an original connection includes
- inserting one or more insulating plugs applied to remove an original board net and to prevent contact to an I/O pad which in turn was connected to the original board net.
2 more elements
A method of making an engineering change for a system board structure, comprising the steps of:
- providing a system board,
- providing a plurality of chip carrier modules for a next level of integration provided by a system board, at least one of which plurality of chip carrier modules has a functional connection that could be desirably changed,
- and providing a flex film carrier between the system board and the chip carrier modules that fulfills a desired engineering change by physically changing an original connection to another desired connection between said chip carrier modules that could be desireably changed and the system board,
- wherein said step of physically changing an original connection includes making changes with a connector composed of two polymer halves that are riveted together into plated through holes in said flex film carrier by a conductive rivet expansion pin which forms part of a base half of the conductor making the connection through the plated through holes which reduce the resistivity of the electrical connection.
1 more element
A method of making an engineering change for a system board structure, comprising the steps of:
- providing a system board,
- providing a plurality of chip carrier modules for a next level of integration provided by a system board, at least one of which plurality of chip carrier modules has a functional connection that could be desirably changed,
- and providing a flex film carrier between the system board and the chip carrier modules that fulfills a desired engineering change by physically changing an original connection to another desired connection between said chip carrier modules that could be desireably changed and the system board,
- wherein said physically changing an original connection includes
- initiating repair or engineering change to change said original connection to another to accomplish said physical changing of the original connection to another desired connection between the chip carrier modules and the system board by the removal of the original polymer structure passing through plated through holes of via(s) of a desired connection change and then an insulated polymer plug is inserted into the plated through holes being changed from the system board side of the carrier and a replacement cap is inserted and held with a pin.
2 more elements
A method of making an engineering change for a system board structure, comprising the steps of:
- providing a system board,
- providing a plurality of chip carrier modules for a next level of integration provided by a system board, at least one of which plurality of chip carrier modules has a functional connection that could be desirably changed,
- and providing a flex film carrier between the system board and the chip carrier modules that fulfills a desired engineering change by physically changing an original connection to another desired connection between said chip carrier modules that could be desireably changed and the system board,
- wherein said step of physically changing an original connection includes
- initiating repair or engineering change to change said original connection to another to accomplish said physical changing of the original connection to another desired connection between the chip carrier modules and the system board by removal of an original fuzz button and installation of an insulated polymer plug into plated through hole for the original connection being changed from the system board side of the carrier.
2 more elements
A method of making an engineering change for a system board structure, comprising the steps of:
- providing a system board,
- providing a plurality of chip carrier modules for said the next level of integration provided by a system board, at least one of which plurality of chip carrier modules has a functional connection that could be desireably changed,
- and providing a flex film carrier between the system board and the chip carrier modules that fulfills a desired engineering change by physically changing an original connection to another desired connection between said chip carrier modules that could be desireably changed and the system board,
- wherein an original connection normally is provided by a conductor made from two conductive polymer halves that are riveted together into the plated through holes with a conductive expansion rivet pin.
1 more element
A method of making an engineering change for a system board structure, comprising the steps of:
- providing a system board,
- providing a plurality of chip carrier modules for a next level of integration provided by a system board, at least one of which plurality of chip carrier modules has a functional connection that could be desirably changed,
- and providing a flex film carrier between the system board and the chip carrier modules that fulfills a desired engineering change by physically changing an original connection to another desired connection between said chip carrier modules that could be desireably changed and the system board,
- wherein said flex film contains two or more conductive reference planes connected using a structure with plated through holes in said Land Grid Array structure with one reference plane being connected to one plated through hold and likewise another reference plane is connected to another plated through hold to form a highly decoupled power supply structure is formed within the flex film carrier.
1 more element
Dependencies are inferred from the claim text.