Solderless bga interconnect
AssigneeIntel Corporation
InventorsTyler LEUTEN, Mohammed RAHMAN, Bilal KHALAF
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Abstract
Embodiments disclosed herein include electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first substrate and a plurality of first conductive pads on the first substrate. In an embodiment, the electronics package further comprises a second substrate and a plurality of second conductive pads on the second substrate. In an embodiment, the electronics package further comprises a plurality of interconnects between the first and second substrate. In an embodiment, each interconnect electrically couples one of the first conductive pads to one of the second conductive pads. In an embodiment, the interconnects comprise strands of conductive material.
Claims25
An electronics package, comprising:
- a first substrate;
- a plurality of first conductive pads on the first substrate;
- a second substrate;
- a plurality of second conductive pads on the second substrate;
- and
- a plurality of interconnects between the first and second substrate, wherein each interconnect electrically couples one of the first conductive pads to one of the second conductive pads, and wherein the interconnects comprise strands of conductive material.
An electronics system, comprising:
- a first substrate having a first conductive pad;
- a second substrate having a second conductive pad;
- and
- a solder-free interconnect electrically coupling the first conductive pad to the second conductive pad.
A method of forming an electronics package, comprising:
- applying a conductive epoxy onto a first conductive pad formed on a first substrate;
- placing a stranded mesh onto the conductive epoxy, wherein the conductive epoxy secures the stranded mesh to the conductive pad;
- and
- positioning a second substrate over the first substrate, wherein a second conductive pad on the second substrate contacts the stranded mesh.
Dependencies are inferred from the claim text.