H05K 2201/1025
Metallic discs
H05K2201/1025 (Metallic discs) appears on 38 US grants and 37 published applications in this corpus.
Search patents in H05K- Granted patents
- 38
- Published applications
- 37
- Assignees
- 32
- Inventors
- 104
- Latest grant
- 30 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 1 |
| 2002 | 2 | 3 |
| 2003 | 1 | 3 |
| 2004 | 1 | 1 |
| 2005 | 1 | 3 |
| 2006 | 1 | 1 |
| 2007 | 3 | 2 |
| 2008 | 1 | 2 |
| 2009 | 0 | 3 |
| 2010 | 1 | 1 |
| 2011 | 1 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 1 |
| 2014 | 2 | 1 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 1 |
| 2018 | 1 | 0 |
| 2019 | 2 | 3 |
| 2020 | 2 | 5 |
| 2021 | 3 | 0 |
| 2022 | 0 | 2 |
| 2023 | 1 | 1 |
| 2024 | 1 | 1 |
| 2025 | 2 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Connector for connecting an electrical termination on a printed circuit, corresponding assembly methods30 Dec 2025US 12,512,611 B2Banks and Acquirers International Holding
- Apparatus, system, and method for implementing multipurpose screw holes in circuit packaging for mobile devices28 Jan 2025US 12,213,241 B2Meta Platforms Technologies, LLC
- Wireless headset and headset box16 Jul 2024US 12,041,406 B2Huawei Technologies Co., Ltd.
- Electronic device for determining the angular position of a motor vehicle shaft9 May 2023US 11,643,133 B2Continental Automotive France
- Resin multilayer substrate and electronic device24 Aug 2021US 11,102,885 B2Murata Manufacturing Co., Ltd.
- Compression defined broaching mounts for a compression-attached memory module (camm) connector platform26 Feb 2026US 2026/0059665 A1Advanced Micro Devices, Inc.
- Apparatus, system, and method for implementing multipurpose screw holes in circuit packaging for mobile devices25 Jul 2024US 2024/0251499 A1Meta Platforms Technologies, LLC
- Connector for connecting an electrical termination on a printed circuit, corresponding assembly methods7 Dec 2023US 2023/0396004 A1Banks and Acquirers International Holding
- Heat transfer member-equipped substrate and method for manufacturing heat transfer member-equipped substate22 Dec 2022US 2022/0408545 A1Autonetworks Technologies, Ltd.
- Wireless Headset and Headset Box30 Jun 2022US 2022/0210535 A1Huawei Technologies Co., Ltd.
Most cited
By later US patents
- Method for forming metallized patterns on the top surface of a printed circuit board34US 5,829,124 AInternational Business Machines Corporation · 1998
- Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball29US 6,424,037 B1Aptos Corporation · 2002
- Connection structure between components for semiconductor apparatus23US 5,010,388 ASumitomo Electric Industries, Ltd. · 1991
- Adapting contacts for connection thereto19US 4,402,450 AWestern Electric Company, Inc. · 1983
- Multilayer printed wiring board18US 4,692,843 AFujitsu Limited · 1987