Adapting contacts for connection thereto
AssigneeWestern Electric Company, Inc.
InventorsBruce C. Abraham, Charles R. Fegley
Life of this patent
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Abstract
Contact pads (18) of a device (12) are adapted for bonding components such as contacts of a circuit assembly thereto. At least two of the pads (18) are interconnected with a member (34) containing bonding material. Portions of the member (34) lying adjacent the pads (18) are then removed to form isolated bodies (42) containing bonding material on the pads (18). The member (37) may be of a composite structure containing bonding material associated with a hard element (61). The bodies (42) formed therefrom contain a hard element portion (62) having dimensions which remain substantially unchanged to define a desired minimum distance between respective pads (18) and contacts when they are bonded together.
Claims8
A method of adapting first contacts for bonding components such as second contacts thereto, comprising:
- interconnecting at least two of the first contacts with a member containing bonding material;
- and
- removing portions of the member adjacent the first contacts thereby forming on each such contact an isolated body containing bonding material.
A method of mounting a device to a substrate, comprising:
- interconnecting at least two contacts on the device with a composite member containing bonding material and a hard element, the dimensions of said element remaining substantially unchanged at conditions suitable for attaching by the bonding material, the contacts of the device to contacts of the substrate;
- and
- removing portions of the composite member adjacent the contacts of the device thereby forming isolated bodies of the composite member upon said contacts.
A method of adapting an array of contacts on a device for connection thereto, comprising:
- forming from a sheet of bonding material at least one array of tabs having free ends projecting generally toward the center of the array and opposite ends fixed to the sheet, said array of tabs corresponding to the array of contacts on the device;
- attaching the device to the sheet by bonding the array of contacts on the device to the array of tabs in the sheet;
- and
- detaching from the sheet the device with the tabs bonded thereto such that the tabs provide material for later reflow bonding of the contacts of the device to contacts of an assembly.
Dependencies are inferred from the claim text.