Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball
AssigneeAptos Corporation
InventorsChung W Ho, Tsing-Chow Wang
Life of this patent
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Abstract
Within a method for forming a solder interconnection structure for use within a microelectronic fabrication, there is first provided a substrate having formed thereover a bond pad. There is then formed upon the bond pad a first solder interconnection layer. There is then formed over the first solder interconnection layer an annular solder non-wettable copper oxide layer which does not cover an upper dome portion of the first solder interconnection layer. There is then formed over the upper dome portion of the first solder interconnection layer and not upon the annular solder non-wettable copper oxide layer a second solder interconnection layer.
Claims6
A solder interconnection structure comprising:
- a substrate;
- a bond pad formed over the substrate;
- a first solder interconnection layer formed upon the bond pad;
- an annular copper oxide layer formed over the first solder interconnection layer but not covering an upper dome portion of the first solder interconnection layer;
- and
- a second solder interconnection layer formed over the first solder interconnection layer but not upon the annular copper oxide layer.
Dependencies are inferred from the claim text.