Connection structure between components for semiconductor apparatus

A connection structure between components of a semiconductor apparatus, comprising:

• a base member made of aluminum nitride having a major surface on which a semiconductor device is to be mounted, said aluminum nitride having a first thermal expansion coefficient, a connection member to be joined to said base member, said connection member being made of an alloy selected from the group consisting of iron-nickel alloys and iron-nickel-cobalt alloys having a second thermal expansion coefficient, a plastically deformable stress relieving member interposed between said aluminum nitride base member and said connection member, and a soldering material for joining said base member, said stress relieving member, and said connection member, said plastically deformable stress relieving member being made of a material selected from the group consisting of copper, copper alloys, nickel alloys, iron, and aluminum having a plastic deformability sufficiently high for relieving a thermal stress caused by a difference between said first and second thermal expansion coefficients of said base member and of said connection member during a cooling process at the time of soldering.