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US 11,102,885 B2Granted
Resin multilayer substrate and electronic device
AssigneeMurata Manufacturing Co., Ltd.
InventorsAtsushi Kasuya, Yusuke Kamitsubo
Life of this patent
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Abstract
A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.
Claims16
A resin multilayer board comprising:
- a substrate including a stack of resin layers;
- a first metal pin penetrating through at least one of the resin layers in a thickness direction;
- and
- a second metal pin penetrating through at least one of the resin layers in the thickness direction;
- wherein
- the first metal pin includes a first end portion exposed at a first main surface of the substrate and a second end portion not exposed at a second main surface of the substrate;
- the second metal pin includes a first end portion not exposed at the first main surface of the substrate and a second end portion exposed at the second main surface of the substrate;
- the first metal pin is electrically connected to the second metal pin;
- a gap is provided at an interface between a lateral side of the first metal pin and the resin layer;
- the gap is between a first portion of the interface and a second portion of the interface;
- and
- the first metal pin contacts the resin layer at each of the first portion of the interface and the second portion of the interface.
9 more elements
A resin multilayer board comprising:
- a substrate including a stack of resin layers;
- and
- a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction;
- wherein
- a gap is provided at an interface between a lateral side of the first metal pin and the resin layer;
- the gap is between a first portion of the interface and a second portion of the interface;
- the first metal pin contacts the resin layer at each of the first portion of the interface and the second portion of the interface;
- and
- the substrate includes a stack of a resin layer made of a first thermoplastic resin and a resin layer made of a second thermoplastic resin having a higher melting point than the first thermoplastic resin.
6 more elements
Dependencies are inferred from the claim text.