Heat transfer member-equipped substrate and method for manufacturing heat transfer member-equipped substate

A heat transfer member-equipped substrate comprising:

• a substrate provided with a through hole;
• a heat transfer member installed in the through hole;
• a heat generating component mounted on one main surface side of the substrate;
• and
• a solder portion where the heat generating component is soldered to one end surface of the heat transfer member,
• wherein a nickel base plating layer is formed on at least the one end surface of the heat transfer member,
• the solder portion is bonded to the nickel base plating layer in a state where a gold plating layer that suppresses oxidization of the nickel base plating layer is blended into the solder portion,
• the heat transfer member includes a first heat transfer portion provided with the one end surface, and a second heat transfer portion directly in contact with and bonded to a surface of the first heat transfer portion on an opposite side to the one end surface,
• the first heat transfer portion is made of copper or a copper alloy,
• the second heat transfer portion is made of aluminum or an aluminum alloy,
• an alumite film is formed on at least a portion of a surface of the second heat transfer portion, and
• the second heat transfer portion is formed in a plate shape that protrudes from a circumference of the first heat transfer portion, and extends out on the other main surface of the substrate from the through hole.