H05K 2201/10242
Metallic cylinders
H05K2201/10242 (Metallic cylinders) appears on 173 US grants and 236 published applications in this corpus.
Search patents in H05K- Granted patents
- 173
- Published applications
- 236
- Assignees
- 139
- Inventors
- 555
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 1 |
| 2002 | 2 | 3 |
| 2003 | 1 | 0 |
| 2004 | 1 | 2 |
| 2005 | 2 | 7 |
| 2006 | 3 | 8 |
| 2007 | 6 | 8 |
| 2008 | 6 | 8 |
| 2009 | 3 | 14 |
| 2010 | 6 | 10 |
| 2011 | 10 | 8 |
| 2012 | 8 | 2 |
| 2013 | 4 | 7 |
| 2014 | 2 | 11 |
| 2015 | 2 | 18 |
| 2016 | 9 | 12 |
| 2017 | 12 | 13 |
| 2018 | 9 | 13 |
| 2019 | 17 | 13 |
| 2020 | 15 | 17 |
| 2021 | 9 | 10 |
| 2022 | 8 | 6 |
| 2023 | 6 | 13 |
| 2024 | 9 | 11 |
| 2025 | 8 | 13 |
| 2026 | 6 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board6 Oct 2026US 12,757,326 B2Samsung Electro-Mechanics Co., Ltd.
- Display module and glass with undercut plastic frame23 Jun 2026US 12,663,832 B2Apple Inc.
- Packaging module, electronic device, and methods for manufacturing the same17 Mar 2026US 12,581,599 B2Huawei Technologies Co., Ltd.
- Stud bumped printed circuit assembly3 Mar 2026US 12,568,576 B2
- Structures for low temperature bonding using nanoparticles24 Feb 2026US 12,564,086 B2Adeia Semiconductor Technologies LLC
- Methods for low temperature bonding using nanoparticles30 Jul 2026US 2026/0223715 A1Adeia Semiconductor Technologies LLC
- Printed circuit board module2 Jul 2026US 2026/0190234 A1Canon Kabushiki Kaisha
- Integrated antenna device and manufacturing method thereof18 Jun 2026US 2026/0173248 A1TMY Technology Inc.
- Coil board, and method for producing a coil board11 Jun 2026US 2026/0162876 A1Turck Holding GmbH
- Assemblies including electronic components bonded to substrates16 Apr 2026US 2026/0107387 A1Honeywell International Inc.
Most cited
By later US patents
- Shaped, self-aligning micro-bump structures123US 5,477,086 ALSI Logic Corporation · 1995
- Systems having shaped, self-aligning micro-bump structures65US 5,767,580 ALSI Logic Corporation · 1998
- Shaped, self-aligning micro-bump structures58US 5,558,271 ALSI Logic Corporation · 1996
- Printed circuit board having solder ball mounting groove pads and a ball grid array package using such a board34US 5,636,104 ASamsung Electronics Co., Ltd. · 1997
- Soldering member for printed wiring boards34US 6,358,630 B1Ibiden Co., Ltd. · 2002