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US 6,358,630 B1Granted
Soldering member for printed wiring boards
AssigneeIbiden Co., Ltd.
InventorsKiyotaka Tsukada, Hiroyuki Kobayashi, Yoshikazu Ukai, Kenji Chihara, Yoshihide Tohyama, Yasuyoshi Okuda, Yoshihiro Kodera
Life of this patent
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Abstract
This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal.
Claims4
A solder member for external connection:
- wherein said solder member is joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member comprises:
- an Sn—Pb based alloy comprising finely powdered copper, platinum and silicon.
A solder member for external connection:
- wherein said solder member is joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, the solder member comprises:
- an Sn—Pb based alloy comprising finely powdered copper, zinc and iron.
Dependencies are inferred from the claim text.