Packaging module, electronic device, and methods for manufacturing the same

An electronic device, comprising a packaging module, a system board, and a function module, wherein the packaging module supplies power to the function module, the packaging module and the function module are surface-mounted to, or inserted into, the system board, and

• wherein the packaging module comprises:
• a molding layer comprising a first molding layer and a second molding layer;
• a first conductive pin and a second conductive pin;
• a printed circuit board (PCB);
• and
• a circuit element,
• wherein a first surface of the PCB is covered with the first molding layer and a second surface of the PCB is covered with the second molding layer, the first surface and the second surface are disposed opposite to each other,
• wherein the circuit element is disposed on at least one of the first surface or the second surface of the PCB,
• wherein a first end of the first conductive pin is electrically connected to the first surface the PCB, the first conductive pin is packaged inside the first molding layer along a first stacking direction of the first surface of the PCB and the first molding layer, and a second end of the first conductive pin is partially exposed on a first outer surface of the first molding layer,
• wherein a first end of the second conductive pin is electrically connected to the second surface of the PCB, the second conductive pin is packaged inside the second molding layer along a second stacking direction of the second surface of the PCB and the second molding layer, and a second end of the second conductive pin is partially exposed on a second outer surface of the second molding layer,
• wherein the first outer surface of the first molding layer is a side surface of the first molding layer and the second outer surface of the second molding layer is a side surface of the second molding layer, the first outer surface and the second outer surface are on a same plane, or an outer surface of the molding layer is a surface of the molding layer that is away from the PCB and a side surface of the molding layer, and
• the first conductive pin is configured to output a first electrical signal from the second end of the first conductive pin that is partially exposed on the side surface of the first molding layer and the second conductive pin is configured to output a second electrical signal from the second end of the second conductive pin that is partially exposed on the side surface of the second molding layer to electrically interact with another system.

A method for manufacturing a packaging module, comprising:

• mounting a circuit element and a conductive pin on at least one of a first surface or a second surface of a printed circuit board (PCB), wherein the conductive pin is electrically connected to the PCB;
• performing molding on the PCB, the circuit element, and the conductive pin, wherein the conductive pin is packaged inside a molding layer along a stacking direction of the PCB and the molding layer;
• grinding a surface of the molding layer that is away from the PCB, wherein the conductive pin in the molding layer is partially exposed on the surface of the molding layer that is away from the PCB;
• and
• cutting the molding layer to obtain the packaging module, wherein:
• the molding layer comprises a first molding layer and a second molding layer, and the conductive pin comprises a first conductive pin and a second conductive pin,
• the first surface of the PCB is covered with the first molding layer, and the second surface of the PCB is covered with the second molding layer,
• a first end of the first conductive pin is electrically connected to the first surface of the PCB, the first conductive pin is packaged inside the first molding layer along a first stacking direction of the first surface of the PCB and the first molding layer, and a second end of the first conductive pin is partially exposed on a first outer surface of the first molding layer,
• a first end of the second conductive pin is electrically connected to the second surface of the PCB, the second conductive pin is packaged inside the second molding layer along a second stacking direction of the second surface of the PCB and the second molding layer, and a second end of the second conductive pin is partially exposed on a second outer surface of the second molding layer,
• the first outer surface of the first molding layer is a side surface of the first molding layer and the second outer surface of the second molding layer is a side surface of the second molding layer, the first outer surface and the second outer surface are on a same plane, and
• wherein the second end of the first conductive pin and the second end of the second conductive pin are partially exposed on the side surface of the molding layer and configured to output a first electrical signal from the second end of the first conductive pin that is partially exposed on the side surface of the first molding layer and the second conductive pin is configured to output a second electrical signal from the second end of the second conductive pin that is partially exposed on the side surface of the second molding layer to electrically interact with another system.