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US 2026/0107387 A1Published application
Assemblies including electronic components bonded to substrates
AssigneeHoneywell International Inc.
InventorsVitan Georgievski, John Fredy Arroyave
Life of this patent
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Abstract
An assembly may include an electronic substrate, an electronic component extending from the electronic substrate, and a bonding well surrounding at least a portion of the electronic component. The bonding well may define at least one opening configured to introduce a bonding composition within the bonding well.
Claims20
An assembly comprising:
- an electronic substrate;
- an electronic component extending from the electronic substrate;
- and
- a bonding well surrounding at least a portion of the electronic component and defining at least one opening configured to introduce a bonding composition within the bonding well.
1 more element
A method comprising:
- aligning a first electronic component extending away from a first electronic substrate through a first apex window of a first bonding well with a second electronic component by moving the first electronic component through a second apex window of a second bonding well;
- and
- reducing a spacing between the first electronic component and the second electronic component,
- wherein the second electronic component extends from a second electronic substrate opposing the first electronic substrate,
- wherein the first bonding well surrounds at least a portion of the first electronic component and defines a first opening configured to introduce a bonding composition within the first bonding well, and
- wherein the second bonding well surrounds at least a portion of the second electronic component and defines a second opening configured to introduce the bonding composition within the second bonding well.
3 more elements
Dependencies are inferred from the claim text.