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US 12,757,326 B2Granted
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorSeung Min Lee
Life of this patent
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Abstract
A printed circuit board including: an insulating layer; a wiring layer disposed on an outermost side of the insulating layer and including a first pad and a first pattern; a first post disposed on the first pattern; and a resist layer disposed on the insulating layer and covering the wiring layer and the first post, wherein the resist layer may have a first protrusion in a region covering the first post and may have a first opening exposing the first pad from the resist layer.
Claims20
A printed circuit board, comprising:
- an insulating layer;
- a wiring layer disposed on an outermost side of the insulating layer and including a first pad and a first pattern;
- a first post disposed on the first pattern;
- and
- a resist layer disposed on the insulating layer and covering the wiring layer and the first post,
- wherein the resist layer includes (i) a first protrusion in a region covering the first post and (ii) a first opening over the first pad.
3 more elements
A printed circuit board, comprising:
- an insulating layer;
- a metal pad disposed at an outermost side of the insulating layer;
- a metal post disposed on the outermost side of the insulating layer and disposed around the metal pad, wherein an outermost surface of the metal post is disposed above an outermost surface of the metal pad;
- and
- a resist layer disposed on the outermost surface of the insulating layer, and covering the metal pad and the metal post,
- wherein an outermost surface of the resist layer protrudes from a region covering the metal post and includes an opening over the metal pad.
3 more elements
Dependencies are inferred from the claim text.