H05K 2201/10204
Dummy component, dummy pcb or template
Official title: Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
H05K2201/10204 (Dummy component, dummy pcb or template) appears on 157 US grants and 171 published applications in this corpus.
Search patents in H05K- Granted patents
- 157
- Published applications
- 171
- Assignees
- 120
- Inventors
- 416
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 0 |
| 2002 | 1 | 9 |
| 2003 | 3 | 6 |
| 2004 | 9 | 7 |
| 2005 | 10 | 7 |
| 2006 | 8 | 6 |
| 2007 | 0 | 6 |
| 2008 | 3 | 3 |
| 2009 | 1 | 11 |
| 2010 | 4 | 8 |
| 2011 | 7 | 13 |
| 2012 | 4 | 4 |
| 2013 | 8 | 6 |
| 2014 | 4 | 3 |
| 2015 | 3 | 18 |
| 2016 | 10 | 5 |
| 2017 | 9 | 9 |
| 2018 | 7 | 6 |
| 2019 | 6 | 4 |
| 2020 | 3 | 10 |
| 2021 | 10 | 7 |
| 2022 | 5 | 4 |
| 2023 | 4 | 7 |
| 2024 | 4 | 6 |
| 2025 | 4 | 3 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Transparent package for use with printed circuit boards14 Jul 2026US 12,684,689 B2Honeywell Federal Manufacturing & Technologies, LLC
- Leakage characterization for electronic circuit temperature monitoring27 Jan 2026US 12,535,537 B2International Business Machines Corporation
- Printed circuit board and method of manufacturing the same13 Jan 2026US 12,526,930 B2Samsung Electro-Mechanics Co., Ltd.
- Circuit board and manufacturing method thereof23 Dec 2025US 12,507,348 B2Samsung Electro-Mechanics Co., Ltd.
- Electronic device including flexible printed circuit board and operating method thereof2 Dec 2025US 12,490,374 B2Samsung Electronics Co., Ltd.
- Dummy Body Embedded in a Component Carrier1 Oct 2026US 2026/0304633 A1AT&S (Chongqing) Company Limited
- Method for manufacturing wiring board, method for manufacturing semiconductor device, wiring board, and semiconductor device24 Sep 2026US 2026/0292975 A1Resonac Corporation
- Printed circuit board and method of manufacturing the same26 Mar 2026US 2026/0089849 A1Samsung Electro-Mechanics Co., Ltd.
- Circuit arrangement23 Oct 2025US 2025/0331105 A1Continental Autonomous Mobility Germany GmbH
- Wiring substrate18 Sep 2025US 2025/0294673 A1Shinko Electric Industries Co., Ltd.
Most cited
By later US patents
- Component crimping apparatus control method, component crimping apparatus, and measuring tool472US 8,078,310 B2Panasonic Corporation · 2011
- Tamper resistant circuit boards118US 7,015,823 B1Systran Federal Corporation · 2006
- Surface mount technology evaluation board having varied board pad characteristics100US 6,888,360 B1Research In Motion Limited · 2005
- High-density double-sided multi-string memory module with resistor for insertion detection93US 5,164,916 ADigital Equipment Corporation · 1992
- Heat distributor for electrical connector65US 6,740,820 B22004