Printed circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Hong Min, Eun Su Kwon
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes a first build-up insulating layer; an interconnect structure buried in an upper side of the first build-up insulating layer and including one or more insulating layers, one or more wiring layers, and one or more via layers; an adhesive disposed between an upper surface of the first build-up insulating layer and an upper surface of the interconnect structure, and having an upper surface exposed from the upper surface of the first build-up insulating layer; and a metal bump including a via portion penetrating the adhesive and a protrusion protruding to the upper surface of the adhesive.
Claims15
A printed circuit board, comprising:
- a first build-up insulating layer;
- an interconnect structure buried in an upper side of the first build-up insulating layer and including one or more insulating layers, one or more wiring layers, and one or more via layers;
- an adhesive disposed between an upper surface of the first build-up insulating layer and an upper surface of the interconnect structure, and having an upper surface exposed from the upper surface of the first build-up insulating layer;
- and
- a metal bump including a via portion penetrating the adhesive and a protrusion protruding, in a direction from the interconnection structure to the adhesive, from the upper surface of the adhesive to a level above the upper surface of the adhesive, and
- wherein the via portion and the protrusion include a same material.
A printed circuit board, comprising:
- a first build-up insulating layer;
- an interconnect structure buried in an upper side of the first build-up insulating layer and including one or more insulating layers, one or more wiring layers, and one or more via layers;
- an adhesive disposed between an upper surface of the first build-up insulating layer and an upper surface of the interconnect structure, and having an upper surface exposed from the upper surface of the first build-up insulating layer;
- and
- a metal bump including a via portion penetrating the adhesive and a protrusion protruding to the upper surface of the adhesive,
- wherein a via of the one or more via layers of the interconnect structure and the via portion of the metal bump are tapered in opposite directions.
Dependencies are inferred from the claim text.