H05K 2201/10098
Components for radio transmission
Official title: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
H05K2201/10098 (Components for radio transmission) appears on 1,331 US grants and 1,737 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,331
- Published applications
- 1,737
- Assignees
- 661
- Inventors
- 3,590
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 2 |
| 2003 | 0 | 2 |
| 2004 | 0 | 1 |
| 2005 | 1 | 7 |
| 2006 | 1 | 9 |
| 2007 | 4 | 8 |
| 2008 | 1 | 10 |
| 2009 | 13 | 21 |
| 2010 | 7 | 20 |
| 2011 | 18 | 18 |
| 2012 | 17 | 35 |
| 2013 | 20 | 33 |
| 2014 | 24 | 51 |
| 2015 | 32 | 75 |
| 2016 | 46 | 58 |
| 2017 | 63 | 84 |
| 2018 | 58 | 117 |
| 2019 | 90 | 125 |
| 2020 | 114 | 166 |
| 2021 | 133 | 183 |
| 2022 | 141 | 160 |
| 2023 | 150 | 190 |
| 2024 | 147 | 138 |
| 2025 | 153 | 132 |
| 2026 | 92 | 92 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Carrier substrate, a method, and an electronic assembly22 Sep 2026US 12,745,343 B2Telefonaktiebolaget LM Ericsson (publ)
- Heat dissipation module and antenna array device having same15 Sep 2026US 12,738,627 B2Chiun Mai Communication Systems, Inc.
- Multilayer dielectric substrate and method for manufacturing multilayer dielectric substrate15 Sep 2026US 12,739,968 B2Murata Manufacturing Co., Ltd.
- Electronic device and manufacturing method thereof8 Sep 2026US 12,733,523 B2Innolux Corporation
- Bend compensation for molded waveguide antennas1 Sep 2026US 12,724,111 B2Aptiv Technologies AG
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0312273 A1Amkor Technology Singapore Holding Pte.Ltd.
- Earphone8 Oct 2026US 2026/0313283 A1Vivo Mobile Communication Co., Ltd.
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Outdoor printed board material and manufacturing method therefor1 Oct 2026US 2026/0304613 A1Resonac Corporation
- Thermosetting resin composition, prepreg, resin film, metal-clad laminate, printed wiring board, antenna device, antenna module, and communication device24 Sep 2026US 2026/0285008 A1Resonac Corporation
Most cited
By later US patents
- Radio frequency tag265US 5,995,006 AIntermec IP Corp. · 1999
- RFID integrated in electronic assets255US 6,249,227 B1Intermec IP Corp. · 2001
- Dielectric waveguide with non-planar interface surface and mating deformable material182US 9,350,063 B2Texas Instruments Incorporated · 2016
- Appendage mountable electronic devices conformable to surfaces111US 9,554,484 B2The Board of Trustees of the University of Illinois · 2017
- Electromagnetically coupled interconnect system94US 6,882,239 B2FormFactor, Inc. · 2005