Bend compensation for molded waveguide antennas

A radio frequency (RF) system comprising:

• a control printed circuit board (PCB) that includes a processor and a transmitter configured to generate RF signals;
• and
• a waveguide antenna attached to the control printed circuit board, the waveguide antenna including an input channel, a bend transition chamber, a waveguide channel, and a radiator, the input channel being configured to receive the RF signals from the control PCB along a first axis, the bend transition chamber being configured to receive the RF signals from the input channel and to route the RF signals to the waveguide channel, the waveguide channel being configured to receive the RF signals from the bend transition chamber along a second axis orthogonal to the first axis and to route the RF signals to the radiator, and the radiator being configured to transmit the RF signals outside of the RF system;
• wherein:
• the bend transition chamber includes a stub chamber having a width along a third axis orthogonal to both the first axis and the second axis that is greater than a width of the input channel along the third axis and greater than a width of the waveguide channel along the third axis;
• the waveguide antenna includes an upper waveguide part and a lower waveguide part that are each formed by a molding process;
• the upper waveguide part includes an upper chamber and the lower waveguide part includes a lower chamber such that the bend transition chamber is formed by the upper and lower chambers when the upper and lower waveguide parts are assembled together;
• the upper waveguide part includes an upper waveguide portion and the lower waveguide part includes a lower waveguide portion such that the waveguide channel is formed by the upper and lower waveguide portions when the upper and lower waveguide parts are assembled together;
• and
• the upper and lower waveguide parts are symmetrical along a plane formed by the second and third axes and assembled together in the RF system without conductive paste and without solder.