Heat dissipation module and antenna array device having same
AssigneeChiun Mai Communication Systems, Inc.
InventorsChun-Chih Chen, Kuang-Chen Wu, Ke-Xuan Luo, Po-Ching Huang
Life of this patent
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Abstract
A heat dissipation module and an antenna array device applying the heat dissipation module are provided, the antenna array device includes an upper cover and a circuit board, the heat dissipation module includes a body; a plurality of heat-conducting structures arranged in an array on one side of the body; a plurality of supporting structures supporting the circuit board, the plurality of heat-conducting structures and the plurality of supporting structures arranged on a same side of the body; and a plurality of connecting structures arranged on an edge of the body and connected to the upper cover.
Claims20
A heat dissipation module applied in an antenna array device, the antenna array device comprising an upper cover and a circuit board, the heat dissipation module comprising:
- a body;
- a plurality of heat-conducting structures arranged in an array on one side of the body;
- a plurality of radiation units arranged on a side of the circuit board, the plurality of heat-conducting structures arranged on the other side of the circuit board away from the plurality of radiation units, the plurality of heat-conducting structures corresponding to the plurality of radiation units;
- a plurality of supporting structures supporting the circuit board, the plurality of heat-conducting structures and the plurality of supporting structures arranged on a same side of the body;
- and
- a plurality of connecting structures arranged on an edge of the body and connected to the upper cover.
An antenna array device comprising:
- an upper cover;
- a circuit board;
- and
- a heat dissipation module comprising:
- a body;
- a plurality of heat-conducting structures arranged in an array on one side of the body;
- a plurality of radiation units arranged on a side of the circuit board, the plurality of heat-conducting structures are arranged on the other side of the circuit board away from the plurality of radiation units, the plurality of heat-conducting structures are corresponding to the plurality of radiation units;
- a plurality of supporting structures supporting the circuit board, the plurality of heat-conducting structures and the plurality of supporting structures arranged on a same side of the body;
- and
- a plurality of connecting structures arranged on an edge of the body and connected to the upper cover.
Dependencies are inferred from the claim text.