H05K 2201/0723
Provided by an inner layer of pcb
Official title: provided by an inner layer of PCB
H05K2201/0723 (Provided by an inner layer of pcb) appears on 259 US grants and 301 published applications in this corpus.
Search patents in H05K- Granted patents
- 259
- Published applications
- 301
- Assignees
- 176
- Inventors
- 713
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 6 |
| 2004 | 3 | 3 |
| 2005 | 2 | 14 |
| 2006 | 6 | 6 |
| 2007 | 9 | 7 |
| 2008 | 3 | 10 |
| 2009 | 7 | 6 |
| 2010 | 6 | 3 |
| 2011 | 6 | 5 |
| 2012 | 4 | 3 |
| 2013 | 4 | 9 |
| 2014 | 4 | 16 |
| 2015 | 12 | 25 |
| 2016 | 15 | 8 |
| 2017 | 11 | 16 |
| 2018 | 18 | 17 |
| 2019 | 21 | 25 |
| 2020 | 23 | 22 |
| 2021 | 17 | 23 |
| 2022 | 24 | 23 |
| 2023 | 14 | 25 |
| 2024 | 27 | 13 |
| 2025 | 15 | 12 |
| 2026 | 5 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Mechanical mitigation of neutron see22 Sep 2026US 12,745,644 B2Rockwell Collins, Inc.
- Display module accounting for ESD phenomenon, and electronic device comprising display module21 Jul 2026US 12,690,123 B2Samsung Electronics Co., Ltd.
- Interlocking structure for crosstalk reduction and method of manufacture9 Jun 2026US 12,652,750 B1Astera Labs, Inc.
- Capacitance sensor and method for producing capacitance sensor17 Mar 2026US 12,578,494 B2Fujikura Ltd.
- Electronic device13 Jan 2026US 12,526,913 B2Hitachi Astemo, Ltd.
- Flexible circuit board, display module and display apparatus3 Sep 2026US 2026/0262160 A1Boe Technology Group Co., Ltd.
- Semicondcutor device and semicondcutor module arrangement28 May 2026US 2026/0150697 A1Infineon Technologies AG
- In-module shielding19 Feb 2026US 2026/0052998 A1
- Component carrier with signal conductive element and shielding conductive structure5 Feb 2026US 2026/0040432 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Carrier structure and electronic package having the same13 Nov 2025US 2025/0351262 A1Siliconware Precision Industries Co., Ltd.
Most cited
By later US patents
- Ultra slim RF package for ultrabooks and smart phones63US 8,890,628 B2Intel Corporation · 2014
- Wireless communication technology, apparatuses, and methods58US 11,424,539 B2Intel Corporation · 2022
- Selective deposition of magnetic particles and using magnetic material as a carrier medium to deposit nanoparticles55US 9,251,458 B2Féinics AmaTech Teoranta · 2016
- Isolator with integral transformer51US 8,772,909 B1VLT, Inc. · 2014
- Method of fabricating a high-layer-count backplane48US 6,941,649 B2Force10 Networks, Inc. · 2005