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US 2026/0052998 A1Published application
In-module shielding
OwnerDavid Richard Pehlkeinventor
Life of this patent
Estimating the term…
Abstract
A device may include a set of two or more layers including printed circuit boards (PCBs). A device may include a first recess formed within the set of two or more layers.
Claims20
A multi-chip module comprising:
- a set of two or more layers including printed circuit boards (PCBs);
- and
- a first recess formed within the set of two or more layers.
A multi-chip module comprising:
- a first set of two or more layers including printed circuit boards (PCBs);
- a second set of two or more layers including PCBs;
- and
- a first recess formed between the first set and the second set.
1 more element
A module comprising:
- a first set of layers including printed circuit boards (PCBs);
- a second set layers including PCBs;
- and
- a first recess formed between the first set and the second set.
1 more element
Dependencies are inferred from the claim text.