Carrier structure and electronic package having the same

An electronic package, comprising:

• a carrier structure, comprising:
• a lower shielding layer comprising a plurality of lower shielding areas and a first separation lane separating the plurality of lower shielding areas;
• a circuit layer located above the lower shielding layer and comprising a plurality of conductive traces, at least one grounding block and a plurality of second separation lanes located between the plurality of conductive traces and the at least one grounding block, wherein a location of any one of the second separation lanes does not correspond to a location of the first separation lane;
• an upper shielding layer located above the circuit layer and comprising a plurality of upper shielding areas and a third separation lane located between the plurality of upper shielding areas, wherein a location of the third separation lane does not correspond to the location of any one of the second separation lanes;
• and
• at least two insulation layers formed between the lower shielding layer and the circuit layer, and between the circuit layer and the upper shielding layer respectively, wherein each of the insulation layers is formed with a plurality of conductive vias therein;
• and
• at least one electronic component disposed on and electrically connected to the carrier structure.