H05K 13/0408
Incorporating a pick-up tool
Official title: {Incorporating a pick-up tool}
H05K13/0408 (Incorporating a pick-up tool) appears on 932 US grants and 734 published applications in this corpus.
Search patents in H05K- Granted patents
- 932
- Published applications
- 734
- Assignees
- 267
- Inventors
- 1,555
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 5 | 0 |
| 1981 | 6 | 0 |
| 1982 | 4 | 0 |
| 1983 | 3 | 0 |
| 1984 | 4 | 0 |
| 1985 | 4 | 0 |
| 1986 | 10 | 0 |
| 1987 | 8 | 0 |
| 1988 | 10 | 0 |
| 1989 | 24 | 0 |
| 1990 | 12 | 0 |
| 1991 | 13 | 0 |
| 1992 | 12 | 0 |
| 1993 | 22 | 0 |
| 1994 | 16 | 0 |
| 1995 | 13 | 0 |
| 1996 | 19 | 0 |
| 1997 | 11 | 0 |
| 1998 | 18 | 0 |
| 1999 | 20 | 0 |
| 2000 | 26 | 0 |
| 2001 | 26 | 16 |
| 2002 | 30 | 32 |
| 2003 | 19 | 23 |
| 2004 | 28 | 13 |
| 2005 | 24 | 12 |
| 2006 | 14 | 24 |
| 2007 | 14 | 10 |
| 2008 | 10 | 9 |
| 2009 | 11 | 9 |
| 2010 | 5 | 13 |
| 2011 | 6 | 11 |
| 2012 | 9 | 17 |
| 2013 | 12 | 15 |
| 2014 | 17 | 18 |
| 2015 | 8 | 17 |
| 2016 | 11 | 29 |
| 2017 | 16 | 38 |
| 2018 | 22 | 66 |
| 2019 | 50 | 83 |
| 2020 | 71 | 93 |
| 2021 | 82 | 43 |
| 2022 | 79 | 40 |
| 2023 | 35 | 36 |
| 2024 | 35 | 37 |
| 2025 | 24 | 16 |
| 2026 | 11 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Processor module installation tool with protective interlock feature15 Sep 2026US 12,740,034 B2International Business Machines Corporation
- Vacuum adsorption system25 Aug 2026US 12,715,148 B2TE Connectivity Services GmbH
- Mounting apparatus, mounting method, and method for measuring height of substrate18 Aug 2026US 12,713,573 B2Fuji Corporation
- Method for placing a chip for device manufacturing28 Jul 2026US 12,696,398 B2Ciena Corporation
- Part feeder and component mounting machine30 Jun 2026US 12,672,270 B2Panasonic Intellectual Property Management Co., Ltd.
- Monitoring system and monitoring method8 Oct 2026US 2026/0309148 A1Fuji Corporation
- Electronic component transfer device and holder17 Sep 2026US 2026/0282308 A1Kioxia Corporation
- Micro-transfer printing from adhesive surfaces27 Aug 2026US 2026/0249606 A1X-Celeprint Limited
- Placement head for a pick-and-place machine30 Jul 2026US 2026/0216882 A1Prodrive Technologies Innovation Services B.V.
- End-effector, supply cart and automated assembly station using the same18 Jun 2026US 2026/0173339 A1Wiwynn Corporation
Most cited
By later US patents
- Apparatus and method for mounting a chip211US 5,839,187 AMatsushita Electric Industrial Co., Ltd. · 1998
- Electric-component mounting system92US 6,739,036 B2Fuji Machine Mfg. Co., Ltd. · 2004
- Methods and apparatus for bonding an article to a metallized substrate81US 4,295,596 AWestern Electric Company, Inc. · 1981
- Component mounting apparatus72US 5,255,429 AMatsushita Electric Industrial Co., Ltd. · 1993
- Rotary head type electrical component placing apparatus71US 5,153,983 AMatsushita Electric Industrial Co., Ltd. · 1992