H05K 13/041
Having multiple pick-up tools
Official title: {having multiple pick-up tools}
H05K13/041 (Having multiple pick-up tools) appears on 352 US grants and 268 published applications in this corpus.
Search patents in H05K- Granted patents
- 352
- Published applications
- 268
- Assignees
- 102
- Inventors
- 608
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 8 | 0 |
| 1990 | 3 | 0 |
| 1991 | 6 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 7 | 0 |
| 1995 | 4 | 0 |
| 1996 | 12 | 0 |
| 1997 | 4 | 0 |
| 1998 | 8 | 0 |
| 1999 | 11 | 0 |
| 2000 | 16 | 0 |
| 2001 | 11 | 7 |
| 2002 | 12 | 16 |
| 2003 | 10 | 9 |
| 2004 | 11 | 5 |
| 2005 | 13 | 4 |
| 2006 | 7 | 13 |
| 2007 | 10 | 6 |
| 2008 | 5 | 4 |
| 2009 | 5 | 6 |
| 2010 | 2 | 7 |
| 2011 | 2 | 7 |
| 2012 | 5 | 12 |
| 2013 | 8 | 8 |
| 2014 | 10 | 3 |
| 2015 | 5 | 9 |
| 2016 | 3 | 11 |
| 2017 | 8 | 18 |
| 2018 | 8 | 19 |
| 2019 | 15 | 19 |
| 2020 | 24 | 24 |
| 2021 | 23 | 12 |
| 2022 | 17 | 14 |
| 2023 | 11 | 12 |
| 2024 | 8 | 10 |
| 2025 | 11 | 10 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- IC chip-mounting device and IC chip-mounting method26 May 2026US 12,641,766 B2Kabushiki Kaisha Sato
- Micro-transfer printing from adhesive surfaces19 May 2026US 12,629,930 B2X-Celeprint Limited
- Shaft drive device and component mounting device13 Jan 2026US 12,526,970 B2Yamaha Hatsudoki Kabushiki Kaisha
- Mounting tool for a component mounting machine21 Oct 2025US 12,453,068 B2Mycronic AB
- Pick and place system7 Oct 2025US 12,439,577 B2The Boeing Company
- Micro-transfer printing from adhesive surfaces27 Aug 2026US 2026/0249606 A1X-Celeprint Limited
- Component mounting machine and contact determination method9 Apr 2026US 2026/0097525 A1Fuji Corporation
- Pick and place system and methods for use1 Jan 2026US 2026/0006764 A1The Boeing Company
- Component Pick-and Place System, Device and Method thereof13 Nov 2025US 2025/0345939 A1Semiconductor Technologies & Instruments Pte Ltd
- Cloud-Based Electronic Manufacturing Systems7 Aug 2025US 2025/0251720 A1
Most cited
By later US patents
- Apparatus and method for mounting a chip211US 5,839,187 AMatsushita Electric Industrial Co., Ltd. · 1998
- Electric-component mounting system92US 6,739,036 B2Fuji Machine Mfg. Co., Ltd. · 2004
- Rotary head type electrical component placing apparatus71US 5,153,983 AMatsushita Electric Industrial Co., Ltd. · 1992
- Component alignment and transfer apparatus70US 6,289,579 B1Motorola, Inc. · 2001
- Method of and apparatus for mounting electric components66US 4,794,689 AMatsushita Electric Industrial Co., Ltd. · 1989