Mounting apparatus, mounting method, and method for measuring height of substrate

A mounting method of mounting a component on a substrate, the method comprising:

• a contact detecting step of detecting contact between a component held by a holding member and the substrate, the holding member being held by a nozzle holder that includes an air passage inside the nozzle holder, a cylindrical switching valve comprising a communicating hole that communicates outside of the nozzle holder, the contact detected by a change in an air flow rate due to movement of the cylindrical switching valve causing the air passage to communicate with the outside of the nozzle holder via the communicating hole;
• a measurement mounting step of releasing holding of the component to mount the component when the contact is detected by the contact detecting step and measuring a height of the substrate based on a height of the holding member and a height of the component, from when mounting of the components on the substrate is started until when a predetermined number of components of three or more are mounted;
• and
• a normal mounting step of setting a mounting height of the component in accordance with the height of the substrate measured for the predetermined number of components, and mounting remaining components on the substrate based on the mounting height after the measurement mounting step is completed.