H05K 1/0287
Having an universal lay-out
Official title: {having an universal lay-out, e.g. pad or land grid patterns or mesh patterns}
H05K1/0287 (Having an universal lay-out) appears on 500 US grants and 345 published applications in this corpus.
Search patents in H05K- Granted patents
- 500
- Published applications
- 345
- Assignees
- 267
- Inventors
- 1,025
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 5 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 5 | 0 |
| 1983 | 4 | 0 |
| 1984 | 9 | 0 |
| 1985 | 8 | 0 |
| 1986 | 3 | 0 |
| 1987 | 7 | 0 |
| 1988 | 11 | 0 |
| 1989 | 8 | 0 |
| 1990 | 5 | 0 |
| 1991 | 11 | 0 |
| 1992 | 12 | 0 |
| 1993 | 7 | 0 |
| 1994 | 9 | 0 |
| 1995 | 12 | 0 |
| 1996 | 12 | 0 |
| 1997 | 6 | 0 |
| 1998 | 12 | 0 |
| 1999 | 14 | 0 |
| 2000 | 10 | 0 |
| 2001 | 13 | 8 |
| 2002 | 22 | 9 |
| 2003 | 15 | 13 |
| 2004 | 9 | 9 |
| 2005 | 9 | 13 |
| 2006 | 8 | 14 |
| 2007 | 11 | 6 |
| 2008 | 9 | 11 |
| 2009 | 9 | 7 |
| 2010 | 6 | 11 |
| 2011 | 6 | 8 |
| 2012 | 5 | 7 |
| 2013 | 6 | 13 |
| 2014 | 12 | 52 |
| 2015 | 21 | 30 |
| 2016 | 28 | 20 |
| 2017 | 26 | 17 |
| 2018 | 21 | 13 |
| 2019 | 14 | 11 |
| 2020 | 11 | 16 |
| 2021 | 15 | 19 |
| 2022 | 9 | 16 |
| 2023 | 10 | 8 |
| 2024 | 13 | 9 |
| 2025 | 4 | 3 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor substrate, method for designing semiconductor substrate, and apparatus for manufacturing semiconductor substrate25 Aug 2026US 12,720,670 B2NEC Corporation
- Electronic device including EMI absorber9 Jun 2026US 12,651,844 B2Samsung Electronics Co., Ltd.
- Electronic device31 Mar 2026US 12,593,401 B2Magnolia White Corporation
- Systems, methods, and devices for producing interconnects on deformable substrates of electronic devices18 Nov 2025US 12,477,659 B2Meta Platforms Technologies, LLC
- Sensor unit and image forming apparatus including sensor unit11 Nov 2025US 12,471,210 B2Canon Kabushiki Kaisha
- Multilayer wiring substrate9 Jul 2026US 2026/0198161 A1Panasonic Intellectual Property Management Co., Ltd.
- Wiring board2 Jul 2026US 2026/0190220 A1Panasonic Intellectual Property Management Co., Ltd.
- Display device and manufacturing method thereof20 Mar 2025US 2025/0098320 A1Samsung Display Co., Ltd.
- System and method for trace generation and reconfiguration on a breadboard or printed circuit board27 Feb 2025US 2025/0068807 A9
- Field programmable solder ball grid array with embedded control systems6 Feb 2025US 2025/0048561 A1Tesla, Inc.
Most cited
By later US patents
- Two-layer capacitive touchpad and method of making same2,193US 6,188,391 B1Synaptics Incorporated · 2001
- Programmer1,483US 4,213,562 A1980
- Fabric or garment with integrated flexible information infrastructure445US 6,381,482 B1Georgia Tech Research Corporation · 2002
- Rear electrode structures for displays432US 6,445,374 B2E Ink Corporation · 2002
- Capacitance-based proximity with interference rejection apparatus and methods431US 5,565,658 ACirque Corporation · 1996