H05K 1/0289
Having a matrix lay-out, i.e. having selectively interconnectable sets of x-conductors and
Official title: {having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes}
H05K1/0289 (Having a matrix lay-out, i.e. having selectively interconnectable sets of x-conductors and) appears on 319 US grants and 217 published applications in this corpus.
Search patents in H05K- Granted patents
- 319
- Published applications
- 217
- Assignees
- 175
- Inventors
- 657
- Latest grant
- 18 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 6 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 6 | 0 |
| 1990 | 4 | 0 |
| 1991 | 9 | 0 |
| 1992 | 11 | 0 |
| 1993 | 7 | 0 |
| 1994 | 3 | 0 |
| 1995 | 9 | 0 |
| 1996 | 5 | 0 |
| 1997 | 4 | 0 |
| 1998 | 10 | 0 |
| 1999 | 10 | 0 |
| 2000 | 7 | 0 |
| 2001 | 13 | 5 |
| 2002 | 14 | 8 |
| 2003 | 7 | 9 |
| 2004 | 8 | 6 |
| 2005 | 9 | 9 |
| 2006 | 3 | 8 |
| 2007 | 8 | 5 |
| 2008 | 6 | 8 |
| 2009 | 8 | 6 |
| 2010 | 5 | 7 |
| 2011 | 6 | 3 |
| 2012 | 3 | 2 |
| 2013 | 3 | 8 |
| 2014 | 7 | 37 |
| 2015 | 16 | 19 |
| 2016 | 19 | 15 |
| 2017 | 15 | 8 |
| 2018 | 11 | 9 |
| 2019 | 8 | 8 |
| 2020 | 6 | 5 |
| 2021 | 8 | 10 |
| 2022 | 7 | 11 |
| 2023 | 2 | 2 |
| 2024 | 7 | 5 |
| 2025 | 3 | 2 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems, methods, and devices for producing interconnects on deformable substrates of electronic devices18 Nov 2025US 12,477,659 B2Meta Platforms Technologies, LLC
- Electronic component carrier board14 Oct 2025US 12,444,865 B2Global Master Tech. Co., Ltd.
- System and method for trace generation and reconfiguration on a breadboard or printed circuit board25 Feb 2025US 12,236,176 B2
- Flexible substrate22 Oct 2024US 12,127,337 B2Japan Display Inc.
- Flexible substrate8 Oct 2024US 12,112,668 B2Japan Display Inc.
- Multilayer wiring substrate9 Jul 2026US 2026/0198161 A1Panasonic Intellectual Property Management Co., Ltd.
- Wiring board2 Jul 2026US 2026/0190220 A1Panasonic Intellectual Property Management Co., Ltd.
- Display device and manufacturing method thereof20 Mar 2025US 2025/0098320 A1Samsung Display Co., Ltd.
- System and method for trace generation and reconfiguration on a breadboard or printed circuit board27 Feb 2025US 2025/0068807 A9
- Dynamically reconfigurable magnetic circuit systems with tunable conductivity and switchable pathways19 Dec 2024US 2024/0422898 A1
Most cited
By later US patents
- Two-layer capacitive touchpad and method of making same2,193US 6,188,391 B1Synaptics Incorporated · 2001
- Programmer1,483US 4,213,562 A1980
- Fabric or garment with integrated flexible information infrastructure445US 6,381,482 B1Georgia Tech Research Corporation · 2002
- Rear electrode structures for displays432US 6,445,374 B2E Ink Corporation · 2002
- Capacitance-based proximity with interference rejection apparatus and methods431US 5,565,658 ACirque Corporation · 1996