Systems, methods, and devices for producing interconnects on deformable substrates of electronic devices

An electronic device, comprising:

• a deformable substrate comprising a circuit, wherein the circuit comprises:
• a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate;
• a first circuit component adjacent to the first portion of the deformable substrate;
• a second circuit component adjacent to the second portion of the deformable substrate;
• a first metal material formed overlaying a first portion of the deformable substrate comprising a first portion of the channel;
• and
• a second metal material interfacing with the first metal material, thereby substantially occupying an interior volume of the channel and forming an interconnect through the channel, wherein the interconnect is free of degradation in conductivity when the deformable substrate is bent around a cylinder that has a radius of between 14 cm and 25 cm for a period of time between 10 seconds and 1 hour and then released.