Field programmable solder ball grid array with embedded control systems
AssigneeTesla, Inc.
InventorsVijaykumar KRITHIVASAN, Jin ZHAO, Jianjun LI
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Abstract
A field programmable solder BeTA (FPSBGA) module may be utilized to assemble PCB/Substrate in any stack-up configuration. The local field programmable soldering BGA includes control system provides the necessary feedback for effective control of thermal profiles. The FPSBGA enables a control component (110) to cause the execution of the temperature application component (120) to cause a non-uniform application of specified temperature parameters to the substrate.
Claims23
A system, comprising:
- a temperature application component, wherein the temperature application component is controllable in accordance with instructions related to position and temperature;
- and
- a control unit for causing operation of the temperature application component, the control unit including computer-executable instructions that, when executed, cause the control unit to:
- obtain system configuration related to a reflow grid array on a substrate, the system configuration including at least one of a specified temperature parameters for the temperature application component and at least one trace pattern for positioning of the temperature application component along the substrate in accordance with the reflow grid array;
- and
- execute a control program for causing application of the temperature application component in accordance with the at least one trace pattern, wherein application of the temperature application component in accordance with the at least one trace pattern is characterized in non-uniform application of the specified temperature parameters to the substrate.
A control system for causing a selective application of a temperature control component to a substrate, comprising:
- one or more processing components that can execute executable instructions that cause the control system to:
- obtain a specification of at least one trace pattern for positioning of the temperature application component along the substrate in accordance with the reflow grid array;
- and
- execute a control program for causing application of the temperature application component in accordance with the at least one trace pattern, wherein application of the temperature application component in accordance with the at least one trace pattern is characterized in non-uniform application of specified temperature parameters to the substrate.
A control method for application of temperature control components to a substrate comprising:
- obtaining a specification of at least one trace pattern for positioning of the temperature application component along the substrate in accordance with the reflow grid array;
- and
- executing a control program for causing application of the temperature application component in accordance with the at least one trace pattern, wherein application of the temperature application component in accordance with the at least one trace pattern is characterized in non-uniform application of specified temperature parameters to the substrate.
Dependencies are inferred from the claim text.