H05K 1/0281
Reinforcement details thereof
Official title: {Reinforcement details thereof}
H05K1/0281 (Reinforcement details thereof) appears on 585 US grants and 726 published applications in this corpus.
Search patents in H05K- Granted patents
- 585
- Published applications
- 726
- Assignees
- 314
- Inventors
- 1,641
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 0 |
| 2002 | 1 | 3 |
| 2003 | 1 | 6 |
| 2004 | 2 | 8 |
| 2005 | 6 | 8 |
| 2006 | 9 | 12 |
| 2007 | 5 | 9 |
| 2008 | 3 | 10 |
| 2009 | 7 | 9 |
| 2010 | 6 | 14 |
| 2011 | 7 | 17 |
| 2012 | 17 | 22 |
| 2013 | 15 | 23 |
| 2014 | 16 | 26 |
| 2015 | 21 | 46 |
| 2016 | 36 | 39 |
| 2017 | 34 | 33 |
| 2018 | 35 | 42 |
| 2019 | 52 | 55 |
| 2020 | 49 | 82 |
| 2021 | 53 | 69 |
| 2022 | 51 | 38 |
| 2023 | 43 | 46 |
| 2024 | 35 | 34 |
| 2025 | 34 | 43 |
| 2026 | 21 | 32 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board6 Oct 2026US 12,757,320 B2Chipbond Technology Corporation
- Solid state drive apparatus6 Oct 2026US 12,757,344 B2Samsung Electronics Co., Ltd.
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Battery monitoring module and flexible printed wiring board15 Sep 2026US 12,738,547 B2Mektec Corporation
- Flexible printed circuit board18 Aug 2026US 12,713,522 B2Lisa Dräxlmaier GmbH
- Capacitance sensor3 Sep 2026US 2026/0259088 A1Honda Motor Co., Ltd.
- Circuit board and manufacturing method thereof27 Aug 2026US 2026/0255475 A1Avary Holding (Shenzhen) Co., Limited.
- Wire harness6 Aug 2026US 2026/0229860 A1Yazaki Corporation
- Flexible circuit board, cof module, and electronic device including same30 Jul 2026US 2026/0223285 A1LG Innotek Co., Ltd.
- Flexible substrate wire harness and automobile16 Jul 2026US 2026/0200415 A1Changchun Jetty Automotive Technology Co., Ltd.
Most cited
By later US patents
- Fully encapsulated electronics and printed circuit boards515US 10,667,408 B2Covidien LP · 2020
- High density and high signal integrity connector108US 4,911,643 ABeta Phase, Inc. · 1990
- Foldable display apparatus104US 9,173,287 B1LG Display Co., Ltd. · 2015
- Lighting apparatus with enhanced capability of heat dissipation87US 6,857,767 B2Matsushita Electric Industrial Co., Ltd. · 2005
- Flexible circuit board assembly and method70US 5,434,362 AMotorola, Inc. · 1995