Solid state drive apparatus

A solid state drive apparatus comprising:

• a housing comprising a top cover and a bottom cover, the top cover and the bottom cover defining an internal space of the housing;
• a top package substrate module accommodated in the internal space of the housing, and the top package substrate module comprising a top package base substrate;
• a bottom package substrate module separated from the top package substrate module in a vertical direction, the bottom package substrate module accommodated in the internal space of the housing, and the bottom package substrate module comprising a bottom package base substrate;
• and
• a connection member electrically connecting the top package substrate module to the bottom package substrate module,
• wherein the housing has a plurality of screw holes at corners of the housing, the plurality of screw holes including a plurality of top screw holes in the top cover and a plurality of bottom screw holes in the bottom cover,
• the top cover comprises a plurality of protruding bar pressing portions and a plurality of protruding round pressing portions at corners of the top cover,
• the bottom cover comprises a plurality of protruding bar seating portions and a plurality of protruding round seating portions at corners of the bottom cover,
• the top package base substrate comprises a plurality of top protrusions and a plurality of top notches, the plurality of top protrusions are in contact with the plurality of protruding bar seating portions of the bottom cover, and the plurality of protruding round pressing portions of the top cover are in contact with the top package base substrate at the plurality of top notches, and
• the bottom package base substrate comprises a plurality of bottom protrusions and a plurality of bottom notches, the plurality of bottom protrusions are in contact with the plurality of protruding bar pressing portions of the top cover, and the plurality of protruding round seating portions of the bottom cover are in contact with the bottom package base substrate at the plurality of bottom notches.

A solid state drive apparatus comprising:

• a housing comprising a top cover and a bottom cover, the top cover and the bottom cover defining an internal space of the housing;
• a top package substrate module accommodated in the internal space of the housing, and the top package substrate module comprising a top package base substrate and upper semiconductor chips mounted on the top package base substrate;
• a bottom package substrate module separated from the top package substrate module in a vertical direction, the bottom package substrate module accommodated in the internal space of the housing, and the bottom package substrate module comprising a bottom package base substrate and lower semiconductor chips mounted on the bottom package base substrate;
• and
• a connection member comprising a flexible printed circuitry (FPC) connector electrically connecting the top package substrate module to the bottom package substrate module,
• wherein the housing has a plurality of screw holes at corners of the housing, the plurality of screw holes including a plurality of top screw holes in the top cover and a plurality of bottom screw holes in the bottom cover,
• the top cover comprises two top lower sidewalls facing each other, two top higher sidewalls facing each other, a plurality of protruding bar pressing portions protruding toward the internal space of the housing from the two top higher sidewalls, and a plurality of protruding round pressing portions protruding toward the internal space of the housing from portions at the plurality of top screw holes,
• the bottom cover comprises two bottom lower sidewalls facing each other, two bottom higher sidewalls facing each other, a plurality of protruding bar seating portions protruding toward the internal space of the housing from the two bottom higher sidewalls, and a plurality of protruding round seating portions protruding toward the internal space of the housing from portions at the plurality of bottom screw holes,
• the top package base substrate comprises a plurality of top protrusions and a plurality of top notches, the plurality of top protrusions are in contact with top surfaces of the plurality of protruding bar seating portions of the bottom cover, and bottom surfaces of the plurality of protruding round pressing portions of the top cover are in contact with the top package base substrate at the plurality of top notches, and
• the bottom package base substrate comprises a plurality of bottom protrusions and a plurality of bottom notches, the plurality of bottom protrusions are in contact with bottom surfaces of the plurality of protruding bar pressing portions of the top cover, and top surfaces of the plurality of protruding round seating portions of the bottom cover are in contact with the bottom package base substrate at the plurality of bottom notches.