H05K 1/028
Bending or folding regions of flexible printed circuits
Official title: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)}
H05K1/028 (Bending or folding regions of flexible printed circuits) appears on 3,060 US grants and 3,626 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,060
- Published applications
- 3,626
- Assignees
- 1,093
- Inventors
- 6,924
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 10 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 7 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 11 | 0 |
| 1996 | 6 | 0 |
| 1997 | 3 | 0 |
| 1998 | 12 | 0 |
| 1999 | 9 | 0 |
| 2000 | 4 | 0 |
| 2001 | 13 | 2 |
| 2002 | 12 | 19 |
| 2003 | 19 | 28 |
| 2004 | 17 | 32 |
| 2005 | 19 | 33 |
| 2006 | 20 | 36 |
| 2007 | 18 | 40 |
| 2008 | 21 | 40 |
| 2009 | 28 | 40 |
| 2010 | 24 | 55 |
| 2011 | 22 | 58 |
| 2012 | 50 | 80 |
| 2013 | 51 | 71 |
| 2014 | 66 | 137 |
| 2015 | 95 | 215 |
| 2016 | 155 | 253 |
| 2017 | 237 | 263 |
| 2018 | 241 | 316 |
| 2019 | 316 | 323 |
| 2020 | 291 | 296 |
| 2021 | 262 | 308 |
| 2022 | 241 | 280 |
| 2023 | 212 | 211 |
| 2024 | 223 | 219 |
| 2025 | 201 | 166 |
| 2026 | 117 | 105 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board6 Oct 2026US 12,757,320 B2Chipbond Technology Corporation
- Solid state drive apparatus6 Oct 2026US 12,757,344 B2Samsung Electronics Co., Ltd.
- Wearable electronic device including module assembly comprising an optical sensor and wireless charging29 Sep 2026US 12,748,387 B2Samsung Electronics Co., Ltd.
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Laser folded 3D electronics29 Sep 2026US 12,750,950 B2The United States of America as represented by the Secretary of the Army
- Electronic device8 Oct 2026US 2026/0310260 A1Samsung Display Co., Ltd.
- Fastening system for an electronic circuit board1 Oct 2026US 2026/0298449 A1BEGA Gantenbrink-Leuchten KG
- Probe, measuring device, and power line monitoring system1 Oct 2026US 2026/0299050 A1Hydro-Quebec
- Board assembly, board, and electronic device1 Oct 2026US 2026/0304624 A1Wacom Co., Ltd.
- Glasses24 Sep 2026US 2026/0287935 A1Shenzhen Shokz Co., Ltd.
Most cited
By later US patents
- Method for circular stapler control algorithm adjustment based on situational awareness580US 11,109,866 B2Cilag GmbH International · 2021
- Fully encapsulated electronics and printed circuit boards515US 10,667,408 B2Covidien LP · 2020
- Method for adaptive control schemes for surgical network control and interaction396US 11,304,699 B2Cilag GmbH International · 2022
- Flexible circuits for electrosurgical instrument378US 10,555,769 B2Ethicon, Inc. · 2020
- Method of using reinforced flexible circuits with multiple sensors to optimize performance of radio frequency devices288US 11,389,164 B2Cilag GmbH International · 2022