US 2026/0223285 A1 · FLEXIBLE CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE INCLUDING SAME

Abstract

A flexible circuit board according to an embodiment includes a substrate including a first surface and a second surface opposite to the first surface; a first circuit pattern disposed on the first surface; a second circuit pattern disposed on the first surface and the second surface; a third circuit pattern disposed on the first surface and the second surface; a first protective layer disposed on the first surface; and a second protective layer disposed on the second surface, wherein a chip mounting region is defined on the first surface, wherein the first circuit pattern includes a first pad part connected to a chip on the chip mounting region; a second pad part connected to an external printed circuit board; and a first wiring part connected to the first pad part and the second pad part, wherein the second circuit pattern includes a third pad part connected to the chip; a fourth pad part connected to an external display panel; and a second wiring part connected to the third pad part and the fourth pad part, wherein the third circuit pattern includes a fifth pad part connected to the chip; a sixth pad part connected to the display panel; and a third wiring part connected to the fifth pad part and the sixth pad part, wherein the second circuit pattern includes a first via connecting a second wiring part on the first surface and a second wiring part on the second surface, wherein the second wiring part is defined by a first length which is a distance from an end of the fourth pad part to a first via closest to the fourth pad part; and a second length which is a length of the fourth pad part, and wherein the first length is longer than the second length.

Claims19

Dependent claims

A flexible circuit board comprising:

a substrate including a first surface and a second surface opposite to the first surface;
a first circuit pattern disposed on the first surface;
a second circuit pattern disposed on the first surface and the second surface;
a third circuit pattern disposed on the first surface and the second surface;
a first protective layer disposed on the first surface;
and
a second protective layer disposed on the second surface,
wherein a chip mounting region is defined on the first surface,
wherein the first circuit pattern includes a first pad part connected to a chip on the chip mounting region;
a second pad part connected to an external printed circuit board;
and a first wiring part connected to the first pad part and the second pad part,
wherein the second circuit pattern includes a third pad part connected to the chip;
a fourth pad part connected to an external display panel;
a second wiring part connected to the third pad part and the fourth pad part;
and a first via connecting a second wiring part on the first surface and a second wiring part on the second surface,
wherein the third circuit pattern includes a fifth pad part connected to the chip;
a sixth pad part connected to the display panel;
and a third wiring part connected to the fifth pad part and the sixth pad part,
wherein the second circuit pattern is defined by a first length which is a distance from an end of the fourth pad part to a first via closest to the fourth pad part;
second length which is a length of the fourth pad part;
and a third length, which is a length from the first via closest to the fourth pad part to a first via farthest from the fourth pad part, and
wherein the first length is greater than the second length and smaller than the third length.

19 more elements

An electronic device comprising:

a flexible circuit board;
a chip disposed on the flexible circuit board;
a printed circuit board connected to one end of the flexible circuit board;
and
a display panel connected to another end of the flexible circuit board, wherein the flexible circuit board includes:
a substrate including a first surface and a second surface opposite to the first surface;
a first circuit pattern disposed on the first surface;
a second circuit pattern disposed on the first surface and the second surface;
a third circuit pattern disposed on the first surface and the second surface;
a first protective layer disposed on the first surface;
and
a second protective layer disposed on the second surface,
wherein a chip mounting region is defined on the first surface,
wherein the first circuit pattern includes a first pad part connected to a chip on the chip mounting region;
a second pad part connected to an external printed circuit board;
and a first wiring part connected to the first pad part and the second pad part,
wherein the second circuit pattern includes a third pad part connected to the chip;
a fourth pad part connected to an external display panel;
a second wiring part connected to the third pad part and the fourth pad part;
and a first via connecting a second wiring part on the first surface and a second wiring part on the second surface,
wherein the third circuit pattern includes a fifth pad part connected to the chip;
a sixth pad part connected to the display panel;
and a third wiring part connected to the fifth pad part and the sixth pad part,
wherein the second circuit pattern is defined by a first length which is a distance from an end of the fourth pad part to a first via closest to the fourth pad part;
a second length which is a length of the fourth pad part;
and a third length, which is a length from the first via closest to the fourth pad part to a first via farthest from the fourth pad part, and
wherein the first length is greater than the second length and smaller than the third length.

24 more elements

Dependencies are inferred from the claim text.

Flexible circuit board, cof module, and electronic device including same

Life of this patent

Flexible circuit board, cof module, and electronic device including same

Life of this patent

Abstract

Claims19