H05K 1/0231
Capacitors or dielectric substances
Official title: {Capacitors or dielectric substances}
H05K1/0231 (Capacitors or dielectric substances) appears on 1,351 US grants and 1,318 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,351
- Published applications
- 1,318
- Assignees
- 500
- Inventors
- 2,544
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 7 | 0 |
| 1986 | 8 | 0 |
| 1987 | 7 | 0 |
| 1988 | 6 | 0 |
| 1989 | 6 | 0 |
| 1990 | 5 | 0 |
| 1991 | 9 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 7 | 0 |
| 1995 | 12 | 0 |
| 1996 | 8 | 0 |
| 1997 | 5 | 0 |
| 1998 | 19 | 0 |
| 1999 | 19 | 0 |
| 2000 | 21 | 0 |
| 2001 | 26 | 16 |
| 2002 | 36 | 67 |
| 2003 | 54 | 64 |
| 2004 | 63 | 60 |
| 2005 | 39 | 63 |
| 2006 | 68 | 76 |
| 2007 | 57 | 73 |
| 2008 | 44 | 84 |
| 2009 | 43 | 71 |
| 2010 | 63 | 61 |
| 2011 | 63 | 47 |
| 2012 | 69 | 50 |
| 2013 | 47 | 50 |
| 2014 | 44 | 54 |
| 2015 | 57 | 49 |
| 2016 | 33 | 28 |
| 2017 | 42 | 41 |
| 2018 | 43 | 57 |
| 2019 | 53 | 53 |
| 2020 | 51 | 45 |
| 2021 | 39 | 41 |
| 2022 | 43 | 46 |
| 2023 | 38 | 41 |
| 2024 | 30 | 30 |
| 2025 | 33 | 36 |
| 2026 | 19 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Ground connection for automotive shielded cables6 Oct 2026US 12,756,119 B1Infineon Technologies Americas Corp.
- Structurally enhanced filtering of circuit board planes18 Aug 2026US 12,713,518 B2Microsoft Technology Licensing, LLC
- Electronic device18 Aug 2026US 12,713,891 B2Advanced Semiconductor Engineering, Inc.
- Electronic chips with surface mount component2 Jun 2026US 12,648,228 B2STMicroelectronics (Alps) SAS
- Printed circuit board including interdigital slots and/or splits on reference planes for reducing EMI5 May 2026US 12,621,926 B2Turkiye Bilimsel Ve Teknolojik Arastirma Kurumu
- Semiconductor Package with Integrated Capacitors13 Aug 2026US 2026/0239991 A1Chipletz, Inc.
- Wiring board, electronic-component-mounting package using wiring board, and electronic module16 Jul 2026US 2026/0206127 A1KYOCERA Corporation
- Connector substrate assembly capable of covering ac capacitor, and female connector thereof11 Jun 2026US 2026/0164560 A1Amphenol East Asia Limited Taiwan Branch (H.K.)
- Electronic device and method of suppressing signal noise generated by buck-boost circuit28 May 2026US 2026/0150183 A1Inventec Corporation
- Electronic apparatus and control method thereof21 May 2026US 2026/0141875 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Low-cost accelerometer370US 6,336,365 B12002
- Surface mount multilayer capacitor225US 5,880,925 AAVX Corporation · 1999
- Electrical connector having time-delayed signal compensation225US 5,997,358 ALucent Technologies Inc. · 1999
- Midplane especially applicable to an orthogonal architecture electronic system215US 7,108,556 B2Amphenol Corporation · 2006
- Filter structures for integrated circuit interfaces173US 6,208,225 B1FormFactor, Inc. · 2001