H03H 9/02897
Of strain or mechanical damage
Official title: {of strain or mechanical damage, e.g. strain due to bending influence}
H03H9/02897 (Of strain or mechanical damage) appears on 123 US grants and 144 published applications in this corpus.
Search patents in H03H- Granted patents
- 123
- Published applications
- 144
- Assignees
- 47
- Inventors
- 266
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 2 |
| 2003 | 0 | 3 |
| 2004 | 2 | 6 |
| 2005 | 2 | 2 |
| 2006 | 7 | 2 |
| 2007 | 2 | 4 |
| 2008 | 2 | 0 |
| 2009 | 0 | 2 |
| 2010 | 0 | 6 |
| 2011 | 4 | 2 |
| 2012 | 1 | 2 |
| 2013 | 3 | 1 |
| 2014 | 3 | 3 |
| 2015 | 2 | 2 |
| 2016 | 3 | 5 |
| 2017 | 3 | 7 |
| 2018 | 2 | 12 |
| 2019 | 6 | 17 |
| 2020 | 13 | 13 |
| 2021 | 9 | 12 |
| 2022 | 10 | 4 |
| 2023 | 17 | 18 |
| 2024 | 9 | 11 |
| 2025 | 7 | 4 |
| 2026 | 6 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Packaged acoustic wave devices with multilayer piezoelectric substrate18 Aug 2026US 12,712,519 B2Skyworks Solutions, Inc.
- Composite substrate7 Jul 2026US 12,676,589 B2Shin-Etsu Chemical Co., Ltd.
- Method of making packaged acoustic wave devices with multilayer piezoelectric substrate26 May 2026US 12,640,699 B2Skyworks Solutions, Inc.
- Piezoelectric device26 May 2026US 12,640,704 B2Murata Manufacturing Co., Ltd.
- Surface acoustic wave filters with suppressed cavity bending3 Mar 2026US 12,567,856 B2Skyworks Solutions, Inc.
- Raised electrodes in piezoelectric devices25 Jun 2026US 2026/0180543 A1RF360 Singapore Pte. Ltd.
- Multilayer piezoelectric substrate surface acoustic wave device with multilayer interdigital transducer electrode11 Jun 2026US 2026/0163549 A1Skyworks Solutions, Inc.
- Saw device having multiple filter bands and method for manufacturing the same2 Apr 2026US 2026/0095143 A1Wisol Co., Ltd.
- Substrate, Electronic Device, and Module5 Feb 2026US 2026/0039274 A1Quanzhou Sanan Integrated Circuit Co., Ltd.
- Packaging of surface acoustic wave device having multilayer piezoelectric substrate18 Sep 2025US 2025/0293664 A1Skyworks Solutions, Inc.
Most cited
By later US patents
- Saw filter device and method employing normal temperature bonding for producing desirable filter production and performance characteristics289US 7,105,980 B2Sawtek, Inc. · 2006
- Method of forming a surface acoustic wave (SAW) filter device50US 7,213,314 B2Triquint, Inc. · 2007
- Saw device and its manufacturing method48US 5,844,347 AMatsushita Electric Industrial Co., Ltd. · 1998
- Surface acoustic wave device with a layered conductive film and method of producing the same42US 6,377,138 B1Kabushiki Kaisha Toshiba · 2002
- Surface acoustic wave device with multilayer electrodes and method for manufacturing the same29US 5,909,156 AFujitsu Limited · 1999