H03H 2009/2421
With i shape [ibar]
Official title: {with I shape [IBAR]}
H03H2009/2421 (With i shape [ibar]) appears on 5 US grants and 5 published applications in this corpus.
Search patents in H03H- Granted patents
- 5
- Published applications
- 5
- Assignees
- 4
- Inventors
- 16
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 2 |
| 2017 | 1 | 0 |
| 2018 | 1 | 0 |
| 2019 | 1 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
| 2026 | 1 | 0 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- MEMS resonator10 Mar 2026US 12,574,002 B2KYOCERA Technologies Oy
- MEMS device27 Aug 2019US 10,396,752 B2Murata Manufacturing Co., Ltd.
- Method of trimming a component and a component trimmed by such a method6 Feb 2018US 9,887,687 B2Analog Devices Global
- Method of manufacturing a temperature-compensated micromechanical resonator22 Aug 2017US 9,742,373 B2The Regents of the University of Michigan
- Micromechanical resonator with enlarged portion20 Aug 2013US 8,513,864 B2
- Mems resonator27 Feb 2025US 2025/0070745 A1KYOCERA Technologies Oy
- Mems device3 Nov 2016US 2016/0322954 A1Murata Manufacturing Co., Ltd.
- Method of trimming a component and a component trimmed by such a method28 Jul 2016US 2016/0219719 A1Analog Devices Global
- Temperature-compensated micromechanical resonator2 May 2013US 2013/0106246 A1The Regents of the University of Michigan
- Micromechanical resonator with enlarged portion21 Apr 2011US 2011/0089785 A1
Most cited
By later US patents
- Method of manufacturing a temperature-compensated micromechanical resonator4US 9,742,373 B2The Regents of the University of Michigan · 2017
- Micromechanical resonator with enlarged portion2US 8,513,864 B22013
- Method of trimming a component and a component trimmed by such a method1US 9,887,687 B2Analog Devices Global · 2018