Method of trimming a component and a component trimmed by such a method
AssigneeAnalog Devices Global
InventorsSeamus Paul Whiston, Bernard Patrick Stenson, Michael Noel Morrissey, Michael John Flynn
Life of this patent
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Abstract
A method of trimming a component is provided in which the component is protected from oxidation or changes in stress after trimming. As part of the method, a protective glass cover is bonded to the surface of a semiconductor substrate prior to trimming (e.g., laser trimming) of a component. This can protect the component from oxidation after trimming, which may change its value or a parameter of the component. It can also protect the component from changes in stress acting on it or on the die adjacent it during packaging, which may also change a value or parameter of the component.
Claims21
A method of trimming a component formed on a substrate, the method comprising:
- securing a transparent cover to the substrate so as to provide a protected volume around the component prior to dicing a wafer that includes the component, the transparent cover having a surface patterned with regularly spaced depressions;
- and
- trimming the component to adjust a parameter of the component, wherein the trimming comprises applying light through the surface of the transparent cover to the component.
A microelectronic circuit comprising at least a first component formed on a substrate, wherein the first component has a parameter that varies as a function of a fabrication process changes used in the formation of the microelectronic circuit, wherein the microelectronic circuit comprises a laser-transparent cover secured to the substrate so as to form a hermetically sealed enclosure around the first component, the laser-transparent cover having a surface patterned with regularly spaced depressions, wherein the first component comprises a microelectrical mechanical systems (MEMS) component that includes piezoelectric layer, and wherein a trim site of the first component lacks oxidation.
A microelectronic circuit formed by a process that comprises laser trimming a microelectrical mechanical systems (MEMS) component formed on a substrate while the MEMS component is within a sealed enclosure formed at least partly by a laser-transparent material coupled to the substrate prior to dicing a wafer that includes the MEMS component, the laser-transparent material having a surface patterned with regularly spaced depressions, wherein the MEMS component has a parameter that varies as a function of a fabrication process changes used in the formation of the microelectronic circuit.
Dependencies are inferred from the claim text.