H01S 5/0237
By soldering
Official title: by soldering
H01S5/0237 (By soldering) appears on 1,036 US grants and 1,153 published applications in this corpus.
Search patents in H01S- Granted patents
- 1,036
- Published applications
- 1,153
- Assignees
- 411
- Inventors
- 2,129
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 5 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 0 | 0 |
| 1991 | 5 | 0 |
| 1992 | 4 | 0 |
| 1993 | 6 | 0 |
| 1994 | 10 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 17 | 0 |
| 1999 | 16 | 0 |
| 2000 | 14 | 0 |
| 2001 | 24 | 10 |
| 2002 | 30 | 35 |
| 2003 | 32 | 48 |
| 2004 | 42 | 48 |
| 2005 | 30 | 60 |
| 2006 | 38 | 50 |
| 2007 | 28 | 51 |
| 2008 | 29 | 47 |
| 2009 | 30 | 49 |
| 2010 | 50 | 41 |
| 2011 | 41 | 45 |
| 2012 | 32 | 34 |
| 2013 | 32 | 36 |
| 2014 | 42 | 35 |
| 2015 | 32 | 34 |
| 2016 | 29 | 35 |
| 2017 | 33 | 28 |
| 2018 | 29 | 53 |
| 2019 | 48 | 70 |
| 2020 | 52 | 64 |
| 2021 | 40 | 59 |
| 2022 | 36 | 55 |
| 2023 | 32 | 70 |
| 2024 | 45 | 44 |
| 2025 | 24 | 31 |
| 2026 | 39 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Quantum cascade laser element, quantum cascade laser device, and method for manufacturing quantum cascade laser element25 Aug 2026US 12,719,240 B2Hamamatsu Photonics K.K.
- Substrate for mounting plurality of light sources, light source module, and exposure device1 Oct 2026US 2026/0302720 A1Nichia Corporation
- Light source module, optical engine, image display device, and method for manufacturing light source module1 Oct 2026US 2026/0302722 A1TDK Corporation
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- Electronic device6 Aug 2026US 2026/0229838 A1Sony Semiconductor Solutions Corporation
Most cited
By later US patents
- Method and system of heterogeneous substrate bonding for photonic integration168US 8,630,326 B2Skorpios Technologies, Inc. · 2014
- Method of making a mechanically compliant bump164US 6,458,411 B1Aralight, Inc. · 2002
- Method and system for heterogeneous substrate bonding of waveguide receivers164US 8,611,388 B2Skorpios Technologies, Inc. · 2013
- Optical illuminator129US 8,675,706 B2Princeton Optronics, Inc. · 2014
- Hybrid two-dimensional surface-emitting laser arrays121US 4,881,237 AMassachusetts Institute of Technology · 1989