H01S 5/0202
Cleaving
Official title: {Cleaving}
H01S5/0202 (Cleaving) appears on 577 US grants and 589 published applications in this corpus.
Search patents in H01S- Granted patents
- 577
- Published applications
- 589
- Assignees
- 169
- Inventors
- 973
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 6 | 0 |
| 1996 | 2 | 0 |
| 1997 | 13 | 0 |
| 1998 | 14 | 0 |
| 1999 | 5 | 0 |
| 2000 | 9 | 0 |
| 2001 | 10 | 8 |
| 2002 | 12 | 12 |
| 2003 | 6 | 13 |
| 2004 | 20 | 19 |
| 2005 | 8 | 17 |
| 2006 | 10 | 14 |
| 2007 | 7 | 17 |
| 2008 | 11 | 37 |
| 2009 | 12 | 35 |
| 2010 | 30 | 39 |
| 2011 | 31 | 51 |
| 2012 | 30 | 35 |
| 2013 | 41 | 31 |
| 2014 | 27 | 14 |
| 2015 | 25 | 21 |
| 2016 | 23 | 17 |
| 2017 | 23 | 19 |
| 2018 | 23 | 24 |
| 2019 | 22 | 17 |
| 2020 | 24 | 29 |
| 2021 | 20 | 29 |
| 2022 | 17 | 26 |
| 2023 | 19 | 23 |
| 2024 | 21 | 27 |
| 2025 | 16 | 11 |
| 2026 | 9 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composition and method for making picocrystalline artificial borane atoms6 Oct 2026US 12,757,646 B2SemiNuclear, Inc.
- Ridge waveguide laser with dielectric current confinement29 Sep 2026US 12,749,872 B2Applied Optoelectronics, Inc.
- Quantum cascade laser element, quantum cascade laser device, and method for manufacturing quantum cascade laser element25 Aug 2026US 12,719,240 B2Hamamatsu Photonics K.K.
- Quantum cascade laser element and quantum cascade laser device4 Aug 2026US 12,700,712 B2Hamamatsu Photonics K.K.
- Semiconductor chip and optical module14 Jul 2026US 12,683,360 B2NTT, Inc.
- Edge-emitting semiconductor laser, method of manufacturing a plurality of edge-emitting semiconductor lasers, laser component and method of manufacturing a laser component23 Jul 2026US 2026/0213496 A1ams-OSRAM International GmbH
- Semiconductor laser element18 Jun 2026US 2026/0171749 A1Rohm Co., Ltd.
- Light-emitting diode and light-emitting device16 Apr 2026US 2026/0106436 A1Quanzhou Sanan Semiconductor Technology Co., Ltd.
- Wafer-level etched facet for perpendicular coupling of light from a semiconductor laser device12 Mar 2026US 2026/0074482 A1Skorpios Technologies, Inc.
- Semiconductor laser chip for gas sensor27 Nov 2025US 2025/0364788 A1Mirsense
Most cited
By later US patents
- Method of fabricating epitaxial structures827US 8,455,290 B2Masimo Semiconductor, Inc. · 2013
- Methods for cleaving facets in III-V nitrides grown on c-face sapphire substrates297US 6,379,985 B1Xerox Corporation · 2002
- Semiconductor light emitting device and semiconductor laser289US 6,680,959 B2Rohm Co., Ltd. · 2004
- Growth structures and method for forming laser diodes on {30-31} or off cut gallium and nitrogen containing substrates237US 8,351,478 B2Soraa, Inc. · 2013
- Method of fabricating nitride semiconductor laser234US 7,939,354 B2Sumitomo Electric Industries, Ltd. · 2011