H01S 5/0042
On wafer testing
Official title: {On wafer testing, e.g. lasers are tested before separating wafer into chips}
H01S5/0042 (On wafer testing) appears on 115 US grants and 108 published applications in this corpus.
Search patents in H01S- Granted patents
- 115
- Published applications
- 108
- Assignees
- 69
- Inventors
- 223
- Latest grant
- 15 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 5 | 0 |
| 2001 | 4 | 1 |
| 2002 | 5 | 4 |
| 2003 | 1 | 3 |
| 2004 | 1 | 6 |
| 2005 | 2 | 3 |
| 2006 | 4 | 5 |
| 2007 | 3 | 2 |
| 2008 | 1 | 1 |
| 2009 | 0 | 2 |
| 2010 | 2 | 5 |
| 2011 | 2 | 2 |
| 2012 | 6 | 8 |
| 2013 | 2 | 2 |
| 2014 | 3 | 7 |
| 2015 | 6 | 3 |
| 2016 | 1 | 4 |
| 2017 | 5 | 2 |
| 2018 | 9 | 10 |
| 2019 | 7 | 4 |
| 2020 | 1 | 7 |
| 2021 | 7 | 8 |
| 2022 | 8 | 12 |
| 2023 | 8 | 4 |
| 2024 | 5 | 1 |
| 2025 | 4 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Optical probe, probe card, measuring system, and measuring method15 Jul 2025US 12,360,155 B2Kabushiki Kaisha Nihon Micronics
- Emitter oxidation uniformity within a wafer17 Jun 2025US 12,332,561 B2Lumentum Operations LLC
- Wafer level analysis for VCSEL screening11 Feb 2025US 12,224,550 B2Mellanox Technologies, Ltd.
- Surface-mount compatible VCSEL array7 Jan 2025US 12,191,635 B2Lumentum Operations LLC
- Array device manufacturing method, manufacturing apparatus, and storage medium1 Oct 2024US 12,107,382 B2Sumitomo Electric Industries, Ltd.
- Laser array with emitter isolation29 Jan 2026US 2026/0031593 A1Daylight Solutions, Inc.
- Vcsel chip structure for quick test and method for forming the same13 Feb 2025US 2025/0055256 A1Taiwan-Asia Semiconductor Corporation
- Semiconductor wafer fabrication24 Oct 2024US 2024/0356300 A1Ams Sensors Asia Pte. Ltd.
- Method of manufacturing surface-emitting laser element30 Nov 2023US 2023/0387659 A1Kyoto University
- Semiconductor layer structure with a thin blocking layer28 Sep 2023US 2023/0307891 A1Lumentum Operations LLC
Most cited
By later US patents
- Conductive element with lateral oxidation barrier115US 5,719,891 APicolight Incorporated · 1998
- Oxidizable semiconductor device having cavities which allow for improved oxidation of the semiconductor device54US 6,014,395 APicolight Incorporated · 2000
- Integrated semiconductor diode laser and photodiode structure53US 5,032,879 AInternational Business Machines Corporation · 1991
- Oxidizable semiconductor device having cavities which allow for improved oxidation of the semiconductor device49US 5,903,589 APicolight Incorporated · 1999
- Conductive element with lateral oxidation barrier43US 6,269,109 B1Picolight Incorporated · 2001