Semiconductor wafer fabrication
AssigneeAms Sensors Asia Pte. Ltd.
InventorsBaiming GUO, Qing WANG, Wei Ting CHEN, Feng ZHAO, Alexander MIGLO, Jichi MA, Guoyang XU
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AssigneeAms Sensors Asia Pte. Ltd.
InventorsBaiming GUO, Qing WANG, Wei Ting CHEN, Feng ZHAO, Alexander MIGLO, Jichi MA, Guoyang XU
Estimating the term…
A method of making an optical device. The method comprises providing a semiconductor wafer, providing an array of emitters located on a first side of the wafer and providing one or more optical components on a second, opposite side of the wafer, wherein the or each optical component is arranged to split light from an associated emitter of the array of emitters. The method further comprises emitting light with the associated emitter, receiving light emitted by the associated emitter and transmitted through the optical component on the second side of the wafer, and determining an alignment between the one or more optical components and the array of emitters from the received light.
A method of making an optical device, the method comprising:
A method of making an optical device, the method comprising:
A semiconductor wafer for making an optical device, the wafer comprising:
Dependencies are inferred from the claim text.