Array device manufacturing method, manufacturing apparatus, and storage medium
AssigneeSumitomo Electric Industries, Ltd.
InventorRyosuke Kubota
Life of this patent
Estimating the term…
Abstract
An array device manufacturing method includes the steps of forming a plurality of optical elements on a wafer; inspecting the plurality of optical elements; defining dicing lines on the basis of a result of the inspection such that an array device composed entirely of one or more non-defective ones of the plurality of optical elements is obtained, the one or more non-defective ones being determined to be non-defective in the inspection; and forming the array device by dicing the wafer along the dicing lines.
Claims9
An array device manufacturing method comprising the steps of:
- forming a plurality of optical elements on a wafer;
- inspecting the plurality of optical elements;
- defining dicing lines on the basis of a result of the inspection such that an array device composed entirely of one or more non-defective ones of the plurality of optical elements is obtained, the one or more non-defective ones being determined to be non-defective in the inspection;
- and
- forming the array device by dicing the wafer along the dicing lines, and
- wherein the step of defining dicing lines is a step of defining the dicing lines such that assigning a first array device including more optical elements to a section of the wafer is prioritized over assigning a second array device including less optical elements to a section of the wafer.
An array device manufacturing apparatus comprising:
- an inspection unit configured to inspect a plurality of optical elements formed on a wafer;
- and
- a dicing machine configured to form an array device by dicing the wafer along dicing lines defined such that the array device is composed entirely of one or more non-defective ones of the plurality of optical elements, the one or more non-defective ones being determined to be non-defective in the inspection, and
- wherein the dicing lines are defined such that assigning a first array device including more optical elements to a section of the wafer is prioritized over assigning a second array device including less optical elements to a section of the wafer.
A non-transitory computer-readable storage medium storing a program for manufacturing an array device, the program causing a computer to execute the processes of:
- inspecting a plurality of optical elements formed on a wafer;
- defining dicing lines on the basis of a result of the inspection such that an array device composed entirely of one or more non-defective ones of the plurality of optical elements is obtained, the one or more non-defective ones being determined to be non-defective in the inspection;
- and
- forming the array device by dicing the wafer along the dicing lines, and
- wherein defining the dicing lines is a step of defining the dicing lines such that assigning a first array device including more optical elements to a section of the wafer is prioritized over assigning a second array device including less optical elements to a section of the wafer.
Dependencies are inferred from the claim text.