Surface-mount compatible VCSEL array
AssigneeLumentum Operations LLC
InventorsRichard F. Carson, Nein-Yi Li, Mial E. Warren
Life of this patent
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Abstract
A VCSEL/VECSEL array design is disclosed that results in arrays that can be directly soldered to a PCB using conventional surface-mount assembly and soldering techniques for mass production. The completed VCSEL array does not need a separate package and no precision sub-mount and flip-chip bonding processes are required. The design allows for on-wafer probing of the completed arrays prior to singulation of the die from the wafer. Embodiments relate to semiconductor devices, and more particularly to multibeam arrays of semiconductor lasers for high power and high frequency applications and methods of making and using the same.
Claims20
An array of light-emitting devices, comprising:
- a die having light-emitting structures and first etched trenches therebetween,
- wherein the light-emitting structures have first metal electrical contacts thereon;
- shorted structures separated by second etched trenches,
- wherein the shorted structures have second metal electrical contacts thereon;
- a layer of dielectric material that forms a planarized surface of an etched side of the die;
- first metal pads, patterned in or on the layer of dielectric material, that connect groups of the light-emitting structures or individual light-emitting structures together,
- wherein the first metal pads contact the first metal electrical contacts of the light-emitting devices, and
- wherein a bottom surface, of a metal pad of the first metal pads, is in contact with a first horizontal surface of the layer of dielectric material that is below the planarized surface;
- and
- second metal pads, patterned in or on the layer of dielectric material, that make electrical contact to groups of the shorted structures or individual shorted structures,
- wherein the second metal pads contact the second metal electrical contacts of the shorted structures, and
- wherein a bottom surface, of a metal pad of the second metal pads, is in contact with a second horizontal surface of the layer of dielectric material that is below the planarized surface.
An array of light-emitting devices, comprising:
- a light-emitting structure;
- a first metal electrical contact on the light-emitting structure;
- a shorted structure;
- a second metal electrical contact on the shorted structure;
- a trench between the light-emitting structure and the shorted structure;
- a dielectric layer in the trench,
- wherein the dielectric layer comprises a planarized surface;
- a first metal pad on the first metal electrical contact, and
- wherein a bottom surface, of the first metal pad, is in contact with a first horizontal surface of the dielectric layer that is below the planarized surface;
- and
- a second metal pad on the second metal electrical contact,
- wherein a bottom surface, of the second metal pad, is in contact with a second horizontal surface of the dielectric layer that is below the planarized surface.
An array of light-emitting devices, comprising:
- a first light-emitting structure;
- a first metal electrical contact on the first light-emitting structure;
- a second light-emitting structure;
- a second metal electrical contact on the second light-emitting structure;
- a first trench between the first light-emitting structure and the second light-emitting structure;
- a first shorted structure;
- a third metal electrical contact on the first shorted structure;
- a second shorted structure;
- a fourth metal electrical contact on the second shorted structure;
- a second trench between the first shorted structure and the second shorted structure;
- a dielectric layer in at least a third trench between the first light-emitting structure and the first shorted structure,
- wherein the dielectric layer comprises a planarized surface;
- a first metal pad on the first metal electrical contact, and
- wherein a bottom surface, of the first metal pad, is in contact with a first horizontal surface of the dielectric layer that is below the planarized surface;
- and
- a second metal pad on the third metal electrical contact,
- wherein a bottom surface, of the second metal pad, is in contact with a second horizontal surface of the dielectric layer that is below the planarized surface.
Dependencies are inferred from the claim text.