H01R 43/02
Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of
Official title: for soldered or welded connections
H01R43/02 (Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of) appears on 2,070 US grants and 1,852 published applications in this corpus.
Search patents in H01R- Granted patents
- 2,070
- Published applications
- 1,852
- Assignees
- 886
- Inventors
- 4,140
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 6 | 0 |
| 1978 | 11 | 0 |
| 1979 | 7 | 0 |
| 1980 | 8 | 0 |
| 1981 | 7 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 11 | 0 |
| 1985 | 14 | 0 |
| 1986 | 19 | 0 |
| 1987 | 21 | 0 |
| 1988 | 20 | 0 |
| 1989 | 31 | 0 |
| 1990 | 17 | 0 |
| 1991 | 22 | 0 |
| 1992 | 28 | 0 |
| 1993 | 31 | 0 |
| 1994 | 27 | 0 |
| 1995 | 18 | 0 |
| 1996 | 24 | 0 |
| 1997 | 22 | 0 |
| 1998 | 35 | 0 |
| 1999 | 48 | 0 |
| 2000 | 73 | 0 |
| 2001 | 72 | 26 |
| 2002 | 51 | 33 |
| 2003 | 44 | 67 |
| 2004 | 62 | 76 |
| 2005 | 52 | 59 |
| 2006 | 54 | 66 |
| 2007 | 39 | 42 |
| 2008 | 40 | 58 |
| 2009 | 38 | 44 |
| 2010 | 36 | 43 |
| 2011 | 23 | 40 |
| 2012 | 33 | 48 |
| 2013 | 32 | 64 |
| 2014 | 54 | 86 |
| 2015 | 46 | 88 |
| 2016 | 72 | 70 |
| 2017 | 87 | 92 |
| 2018 | 77 | 105 |
| 2019 | 97 | 118 |
| 2020 | 101 | 125 |
| 2021 | 83 | 103 |
| 2022 | 94 | 110 |
| 2023 | 73 | 83 |
| 2024 | 82 | 87 |
| 2025 | 59 | 63 |
| 2026 | 48 | 56 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H01R 43/0256For soldering or welding connectors to a printed circuit board570
- H01R 43/0207Ultrasonic-, h.f.-, cold- or impact welding474
- H01R 43/0263For positioning or holding parts during soldering or welding process281
- H01R 43/0221Laser welding221
- H01R 43/0235For applying solder162
- H01R 43/0249For simultaneous welding or soldering of a plurality of wires to contact127
- H01R 43/0214Resistance welding108
- H01R 43/0228Without preliminary removing of insulation before soldering or welding84
All 9 subgroupsShow fewer
Recent patents
- Method and apparatus for surface mount connections8 Sep 2026US 12,731,922 B2Ciena Corporation
- Segmented electrical feedthrough1 Sep 2026US 12,725,719 B2Vitesco Technologies GmbH
- Ultrasonic welding method and ultrasonic welding part1 Sep 2026US 12,725,993 B2Schunk Sonosystems GmbH
- Method for creating a low-voltage path of a cell-contacting system25 Aug 2026US 12,718,972 B2Diehl Advanced Mobility GmbH
- Connector with housing having offset terminal protruding surface25 Aug 2026US 12,719,190 B2Sumitomo Wiring Systems, Ltd.
- Improved cable connecting piece8 Oct 2026US 2026/0312306 A1Safetrack Infrasystems SISAB AB
- Cap and electrical connector with cap1 Oct 2026US 2026/0302706 A1Hirose Electric Co., Ltd.
- Electronic module and method of manufacturing electronic module24 Sep 2026US 2026/0291092 A1Shindengen Electric Manufacturing Co., Ltd.
- Method of attaching electrical connections to printed circuit boards10 Sep 2026US 2026/0269550 A1
- Method of manufacturing busbar3 Sep 2026US 2026/0260780 A1Furukawa Electric Co., Ltd.
Most cited
By later US patents
- Method and apparatus for forming an electrical connection185US 5,579,575 ARaychem Corporation · 1996
- Terminating a shield of a malleable coaxial cable155US 4,921,447 AAMP Incorporated · 1990
- Apparatus and method for stacking integrated circuit devices147US 5,454,160 ANCR Corporation · 1995
- Solder mounting of electrical contacts132US 4,767,344 ABurndy Corporation · 1988
- Method of making fine wire interconnections129US 4,437,604 AKulicke and Soffa Industries, Inc. · 1984