H01R 43/0228
Without preliminary removing of insulation before soldering or welding
Official title: {without preliminary removing of insulation before soldering or welding}
H01R43/0228 (Without preliminary removing of insulation before soldering or welding) appears on 84 US grants and 55 published applications in this corpus.
Search patents in H01R- Granted patents
- 84
- Published applications
- 55
- Assignees
- 50
- Inventors
- 147
- Latest grant
- 8 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 4 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 0 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 7 | 2 |
| 2002 | 3 | 4 |
| 2003 | 7 | 6 |
| 2004 | 1 | 4 |
| 2005 | 4 | 6 |
| 2006 | 6 | 2 |
| 2007 | 0 | 2 |
| 2008 | 2 | 1 |
| 2009 | 2 | 4 |
| 2010 | 1 | 1 |
| 2011 | 1 | 1 |
| 2012 | 2 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 1 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 2 |
| 2019 | 1 | 6 |
| 2020 | 4 | 3 |
| 2021 | 0 | 1 |
| 2022 | 2 | 1 |
| 2023 | 2 | 3 |
| 2024 | 3 | 1 |
| 2025 | 1 | 1 |
| 2026 | 0 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Terminal, terminal-equipped electric wire, connection structure, and manufacturing method of terminal-equipped electric wire24 Dec 2024US 12,176,670 B2Yazaki Corporation
- Terminal for flat flexible cable having structured dimples21 May 2024US 11,990,698 B2TE Connectivity Solutions GmbH
- Electrical device with terminal region and method for producing a terminal region20 Feb 2024US 11,909,152 B2TDK Electronics Co., Ltd.
- Electric cable with terminal and method for manufacturing electric cable with terminal17 Oct 2023US 11,791,599 B2Autonetworks Technologies, Ltd.
- Method of attaching electrical connections to printed circuit boards10 Sep 2026US 2026/0269550 A1
- Laser welded strain relief18 Jun 2026US 2026/0171708 A1Aptiv Technologies AG
- Rivet for use in semiconductor module arrangement and method for producing the same2 Apr 2026US 2026/0094986 A1Infineon Technologies AG
- Contact assembly and method of manufacturing a contact assembly6 Mar 2025US 2025/0079727 A1TE Connectivity Solutions GmbH
- Electric connecting apparatus28 Mar 2024US 2024/0106138 A1Robert Bosch GmbH
Most cited
By later US patents
- Covered wire connection structure74US 5,922,993 AYazaki Corporation · 1999
- Covered wire connection structure49US 5,869,784 AYazaki Corporation · 1999
- Covered wire connection method and structure43US 5,925,202 AYazaki Corporation · 1999
- Structure for welding electrical connecting portions to each other using laser light beam38US 5,300,755 AYazaki Corporation · 1994
- Method of connecting covered wires38US 6,226,865 B1Yazaki Corporation · 2001