Covered wire connection method and structure

A covered wire connection structure, comprising:

• two covered wires, each of said wires comprising a conductive wire portion composed of a plurality of core wires and a cover portion covering an outer periphery of the conductive wire portion;
• said wires overlapping one another to form a crossing angle between them;
• wherein the overlapping portion of said wires does not include a cover portion, such that the plurality of core wires of one wire are conductively connected to the plurality of core wires of the other wire, wherein the overlapping wires are sealed between a pair of melt-fixed resin chips, at least one of the resin chips including a wire supporting portion for restricting the crossing angle of said two covered wires;
• and
• wherein said structure is formed by the steps of:
• overlapping the two covered wires;
• placing said wires in a wire supporting portion of the resin chip for restricting a crossing angle of said two covered wires;
• pinching the overlapping portion of said wires between the resin chip having the wire supporting portion and the second resin chip;
• pressurizing and exciting said overlapping portion pinched by said resin chips;
• exposing the conductive wire portions of the covered wires at the overlapping portion;
• conductively connecting the conductive wire portions of said covered wires at said overlapping portion;
• and
• melt-fixing the resin chips to one another to seal the connected overlapping portion of said covered wires with said melted resin chips.

A covered wire connection structure, comprising:

• two covered wires, each of said wires comprising a conductive wire portion composed of a plurality of core wires and a cover portion covering an outer periphery of the conductive wire portion;
• said wires overlapping one another to form a crossing angle between them;
• wherein the overlapping portion of said wires does not include a cover portion, such that the plurality of core wires of one wire are conductively connected to the plurality of core wires of the other wire, wherein the overlapping wires are sealed between a pair of melt-fixed resin chips;
• and
• a protective case for covering the overlapping portion of said wires, said case including a body and a lid, wherein one side of the body is open to receive and be closed by the lid;
• one of said body and said lid including protruding portions for restricting the crossing angle of the two wires at said overlapping portion to a desired angle, wherein said resin chips are integrally formed with said body and said lid, respectively;
• and
• wherein said structure is formed by the steps of:
• introducing the two covered wires into the protective case and overlapping the two covered wires;
• setting the lid of the protective case onto the open portion of the body of the protective case and pinching the overlapping portion of said wires between the pair of resin chips located on the lid and the body, respectively;
• pressurizing and exciting said overlapping portion pinched by said resin chips;
• exposing the conductive wire portions of the covered wires at the overlapping portion;
• conductively connecting the conductive wire portions of said covered wires at said overlapping portion;
• and
• melt-fixing the resin chips to one another to seal the connected overlapping portion of said covered wires with said melted resin chips.