Covered wire connection structure

A covered wire connection structure for conductively connecting members at least one of which is a covered wire having a conductive wire portion and a cover portion formed by coating a resin around an outer periphery of the conductive wire portion, said structure being formed by overlapping said members with each other and pinching an overlapping portion of said members between a pair of resin chips, pressurizing and exciting said overlapping portion pinched by said resin chips using an ultrasonic vibration welding apparatus so as to melt and disperse said cover portion, thereby to expose the conductive wire portion and electrically conductively connect the conductive wire portion of said at least one member members with an other of said members at said overlapping portion and so as to melt-fix said pair of resin chips to seal the overlapping portion of said members with said melted resin chips, characterized in that:

• said pair of the resin chips each has a main melting portion, an auxiliary melting portion, and a cover portion removing portion,
• said main melting portions of the resin chips are melt-fixed to each other to seal said overlapping portion as the main melting portions pinch said overlapping portion,
• said auxiliary melting portions of the resin chips are melt-fixed to each other so as to pinch the cover portion of said at least one covered wire introduced from said main melting portions, and
• said cover portion removing portion is formed in each of said auxiliary melting portions for melting said cover portion and extruding the melted cover portion in a longitudinal direction along said at least one covered wire.