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US 2026/0094986 A1Published application
Rivet for use in semiconductor module arrangement and method for producing the same
AssigneeInfineon Technologies AG
InventorsBalazs Kadar, Regina Nottelmann, Markus Ebers
Life of this patent
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Abstract
A method for forming a rivet for a semiconductor module arrangement comprises providing a disc, the disc comprising a hole or depression, and inserting a first end of a tubular part into the hole or depression.
Claims15
A method for forming a rivet for a semiconductor module arrangement comprising:
- providing a disc, the disc comprising a hole or depression;
- and
- inserting a first end of a tubular part into the hole or depression.
A rivet for a semiconductor module arrangement, the rivet comprising
- a disc comprising a hole or depression;
- and
- a tubular part, wherein a first end of the tubular part is arranged inside the hole or depression.
A semiconductor module arrangement comprising:
- a substrate comprising a dielectric insulation layer and a metallization layer arranged on a first side of the dielectric insulation layer;
- and
- one or more rivets comprising:
- a disc (444) comprising a hole or depression (446);
- and
- a tubular part (442), wherein a first end of the tubular part (442) is arranged inside the hole or depression (446).
3 more elements
Dependencies are inferred from the claim text.