Method of attaching electrical connections to printed circuit boards
OwnerSikai Cheninventor
Life of this patent
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Abstract
A method for soldering electrical connections to printed circuit boards (PCB) having a plurality of LED lights and adjacent PCB pads provides for the application and placement of solder directly onto the PCB pads, attaching electrically conductive metal pieces to the terminus of positive and negative electrode wires, placing the metal pieces which are on the wires onto the solder of the PCB pads, and heating the conductive wire pieces to ultimately create a fixed soldered connection between the metal pieces and the printed PCB pads and hence the PCB itself.
Claims2
A method for soldering electrical connections to printed circuit boards, said steps of the method comprising:
- providing a printed circuit board having a plurality of LED lights, each of the plurality of LED lights having an adjacent printed circuit board pad;
- applying solder directly onto the printed circuit board pads;
- providing a positive electrode wire;
- providing a negative electrode wire;
- attaching an electrically conductive metal piece to the terminus of the positive electrode wire;
- attaching an electrically conductive metal piece to the terminus of the negative electrode wire;
- placing the conductive metal piece of the positive electrode wire on the solder of one of the printed circuit board pads;
- heating the conductive metal piece of the positive electrode wire;
- allowing the solder on said one of said printed circuit board pads to melt;
- allowing the solder on said one of said printed circuit board pads to cool, thereby fusing the metal piece of the positive electrode wire to said one of the printed circuit board pads to form a soldered fixed connection between the metal piece and the printed circuit board pad, and hence the printed circuit board;
- placing the conductive metal piece of the negative electrode wire on the solder of a second printed circuit board pad;
- heating the conductive metal piece of the negative electrode wire;
- allowing the solder on said second printed circuit board pad to melt;
- and
- allowing the solder on said second circuit board pad to cool, thereby fusing the metal piece of the negative electrode wire to said printed circuit board pad to form a fixed soldered connection between the metal piece and the printed circuit board pad and hence the printed circuit board.
Dependencies are inferred from the claim text.