H01R 43/0242
Comprising means for controlling the temperature
Official title: {comprising means for controlling the temperature, e.g. making use of the curie point}
H01R43/0242 (Comprising means for controlling the temperature) appears on 50 US grants and 34 published applications in this corpus.
Search patents in H01R- Granted patents
- 50
- Published applications
- 34
- Assignees
- 38
- Inventors
- 98
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 7 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 1 | 3 |
| 2005 | 1 | 5 |
| 2006 | 1 | 3 |
| 2007 | 2 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 2 | 2 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 1 |
| 2018 | 0 | 2 |
| 2019 | 2 | 1 |
| 2020 | 2 | 2 |
| 2021 | 2 | 2 |
| 2022 | 1 | 1 |
| 2023 | 1 | 1 |
| 2024 | 2 | 3 |
| 2025 | 2 | 2 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for automated monitoring of a soldering process, soldering device with monitoring device14 Apr 2026US 12,603,467 B2ERSA GmbH
- Techniques for soldering on a substrate with a below soldering temperature melting point24 Feb 2026US 12,562,541 B2Logitech Europe S. A.
- Sensor module28 Jan 2025US 12,212,825 B2Sony Semiconductor Solutions Corporation
- Method of using resistance soldering device21 Jan 2025US 12,206,215 B2Aptiv Technologies AG
- Resistance soldering device and method of using said device16 Apr 2024US 11,962,116 B2Aptiv Technologies AG
- High density connector for superconducting applications20 Aug 2026US 2026/0246213 A1IQM Finland Oy
- Cryogenic-compatible hermetic packing for superconducting quantum chips16 Jul 2026US 2026/0206638 A1IQM Finland Oy
- Techniques for soldering on a substrate with a below soldering temperature melting point4 Jun 2026US 2026/0155614 A1Logitech Europe S. A.
- Method and device for a thermal treatment11 Sep 2025US 2025/0286311 A1
- Induction Soldering Method for Terminating Terminals to FFC/PFC Cables to Various Terminals24 Jul 2025US 2025/0239826 A1TE Connectivity Solutions GmbH
Most cited
By later US patents
- Method and apparatus for forming an electrical connection185US 5,579,575 ARaychem Corporation · 1996
- Induction heating of loaded materials106US 5,378,879 ARaychem Corporation · 1995
- Connector containing fusible material and having intrinsic temperature control93US 4,914,267 AMetcal, Inc. · 1990
- Self regulating temperature heater as an integral part of a printed circuit board90US 5,010,233 AAMP Incorporated · 1991
- Autoregulating multi contact induction heater69US 4,789,767 AMetcal, Inc. · 1988