Techniques for soldering on a substrate with a below soldering temperature melting point

A method for soldering comprising:

• providing a first conductor on a first substrate, the first substrate having a melting temperature below a soldering temperature and extending to a soldering point;
• providing a second substrate, smaller than the first substrate, and having a melting temperature above the soldering temperature;
• attaching the second substrate to the first conductor around a soldering point with an adhesive, wherein the second substrate has an opening aligned with the soldering point;
• applying a soldering material to the soldering point;
• heating the soldering material with a soldering head smaller than the second substrate;
• and
• melting the first substrate proximate the soldering point with the heating, while the second substrate, attached to the first conductor with the adhesive, providing support for the first conductor in place of the first substrate proximate the soldering point where the first substrate is melted;
• providing a depression in the first conductor at the soldering point, wherein the depression is a via;
• providing a third substrate with a soldering pad;
• attaching the third substrate to the first substrate so that the soldering pad is aligned with the soldering point;
• and
• causing the soldering material to attach to the soldering pad through the via;
• wherein the third substrate is a printed circuit board (PCB);
• and
• attaching another second substrate to the first substrate between the first substrate and the PCB, the another second substrate having an opening around the soldering pad.